G05B 2219/40066
Stack and align identical layers, laminates, electronic substrate layers
G05B2219/40066 (Stack and align identical layers, laminates, electronic substrate layers) appears on 24 US grants and 32 published applications in this corpus.
Search patents in G05B- Granted patents
- 24
- Published applications
- 32
- Assignees
- 22
- Inventors
- 84
- Latest grant
- 10 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 1 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 1 | 4 |
| 2017 | 0 | 2 |
| 2018 | 1 | 1 |
| 2019 | 5 | 3 |
| 2020 | 1 | 4 |
| 2021 | 2 | 1 |
| 2022 | 4 | 3 |
| 2023 | 1 | 4 |
| 2024 | 5 | 3 |
| 2025 | 2 | 3 |
| 2026 | 1 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Substrate processing apparatus and non-transitory computer readable medium10 Feb 2026US 12,547,154 B2Ebara Corporation
- Semiconductor processing tool and methods of operation16 Dec 2025US 12,500,106 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Process control system including process condition determination using attribute-relative process condition13 May 2025US 12,300,552 B2Texas Instruments Incorporated
- Substrate assembling device and substrate assembling method10 Dec 2024US 12,162,144 B2Kawasaki Jukogyo Kabushiki Kaisha
- Shortened load port for factory interface3 Dec 2024US 12,159,802 B2APPLIED Materials.Inc.
- Method for changing a processing job carried out on a processing machine23 Apr 2026US 2026/0111009 A1Koenig & Bauer Aktiengesellschaft
- System and method for arranging bundles into a pattern and simulating a layer forming operation5 Mar 2026US 2026/0062226 A1A. G. Stacker Inc.
- Semiconductor processing tool and methods of operation27 Nov 2025US 2025/0364295 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Pixel-based rule check for layouts12 Jun 2025US 2025/0189948 A1D2S, Inc.
- Multi-Ply Lamination System20 Feb 2025US 2025/0058557 A1The Boeing Company
Most cited
By later US patents
- On-board metrology (OBM) design and implication in process tool11US 10,388,549 B2APPLIED Materials.Inc. · 2019
- Apparatus for precisely aligning and securing plural plates together3US 7,634,853 B2Advanced Precision Machining, Inc. · 2009
- Training spectrum generation for machine learning system for spectrographic monitoring2US 11,507,824 B2APPLIED Materials.Inc. · 2022
- Method of performing aging for a process chamber1US 10,133,264 B2Semes Co., Ltd. · 2018
- Substrate processing system, substrate processing method, and control program1US 11,086,286 B2Tokyo Electron Limited · 2021