Substrate processing system, substrate processing method, and control program

A substrate processing method for sequentially transferring a plurality of substrates to a plurality of processing modules from a substrate accommodating container accommodating the substrates and processing the substrates, the substrate processing method comprising, when an error has occurred in a certain processing module:

• collecting substrates, that have been unloaded from the substrate accommodating container but have not been processed, in the substrate accommodating container;
• continuing processing of a preceding substrate in a processing module sequentially following the processing module in which the error has occurred;
• retreating an error substrate processed in the processing module in which the error has occurred from the processing module to a retreat position;
• continuing processing of a subsequent substrate processed in a processing module sequentially preceding the processing module in which the error has occurred;
• measuring a time after the error occurrence;
• setting a recovery timeout, for each of the processing modules, as a time to save a wafer after the error occurrence;
• and
• adding a timeout flag to the error substrate of which neglect time from the error occurrence to the re-execution exceeds the recovery timeout.

A computer storing a control program which when executed controls a substrate processing system for sequentially transferring a plurality of substrates from a substrate accommodating container accommodating the substrates to a plurality of processing modules and processing the substrates,

• wherein the computer when executing the control program, controls the substrate processing system to sequentially and serially transfer the substrates to the processing modules and executes:
• collecting substrates, that have been unloaded from the substrate accommodating container but have not been processed, in the substrate accommodating container;
• continuing processing of a preceding substrate in a processing module sequentially following the processing module in which an error has occurred;
• retreating an error substrate processed in the processing module in which the error has occurred from the processing module to a retreat position;
• continuing processing of a subsequent substrate processed in a processing module sequentially preceding the processing module in which the error has occurred measuring time after the error occurrence;
• setting for each of the processing modules a recovery timeout as a time to save a wafer after the error occurrence;
• and
• adding a timeout flag to the error substrate of which neglect time from the error occurrence to the re-execution exceeds the recovery time out.