Semiconductor processing tool and methods of operation

A method, comprising:

• transmitting, by a controller to a deposition tool, a first signal to raise a semiconductor substrate carried by a substrate stage to a deposition region in which a pumping component, comprising an overhang region, is configured to draw a flow of a gas over the semiconductor substrate,
• wherein an edge ring is attached to the substrate stage and includes a protrusion,
• wherein a grounding component is between a top-side surface of the protrusion and an under-side surface of the overhang region,
• wherein the grounding component comprises a grounding strap that comprises a first attach region configured to be attached to the protrusion, a second attach region configured to be attached to the protrusion, and a deformation region between the first attach region and the second attach region,
• wherein a first lead-in from a first edge of the first attach region and a second lead-in from a second edge of the second attach region create a recessed edge within the deformation region;
• and
• transmitting, by the controller to the deposition tool, a second signal to lower the semiconductor substrate from the deposition region.

An apparatus, comprising:

• a controller configured to:
• transmit a first signal to raise a semiconductor substrate carried by a substrate stage to a deposition region in which a pumping plate component is configured to draw a flow of a gas over the semiconductor substrate,
• wherein an edge ring, attached to the substrate stage, includes a protrusion extending outwardly from an outer perimeter of the substrate stage,
• wherein a grounding component is between a top-side surface of the protrusion and an under-side surface of an overhang region of the pumping plate component,
• wherein the grounding component comprises a grounding strap that has attach regions at opposing ends of the grounding strap, and
• wherein the grounding strap comprises a deformation region including at least one recessed edge along an elliptical portion;
• and
• transmit a second signal to lower the semiconductor substrate from the deposition region.