G05B 2219/32272
Decision of next visiting machine selection, where job is to go
G05B2219/32272 (Decision of next visiting machine selection, where job is to go) appears on 14 US grants and 11 published applications in this corpus.
Search patents in G05B- Granted patents
- 14
- Published applications
- 11
- Assignees
- 10
- Inventors
- 56
- Latest grant
- 22 Nov 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 2 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 4 |
| 2004 | 4 | 1 |
| 2005 | 1 | 1 |
| 2006 | 2 | 0 |
| 2007 | 1 | 2 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 2 |
| 2015 | 0 | 0 |
| 2016 | 1 | 0 |
| 2017 | 1 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 1 | 1 |
By publication year.
Recent patents
- Systems and methods for selecting processes to manufacture an object22 Nov 2022US 11,507,060 B2Paperless Parts, Inc.
- Processing instructing device, processing instructing method, computer program and processing device4 Jul 2017US 9,696,711 B2Tokyo Electron Limited
- Substrate processing apparatus, substrate transfer method and storage medium1 Nov 2016US 9,484,235 B2Tokyo Electron Limited
- Method and device for executing work consisting of a plurality of steps under computer control8 Apr 2008US 7,356,375 B2INCS Inc.
- Production control system of autonomous and decentralized type10 Jul 2007US 7,241,044 B1Hitachi, Ltd.
- Systems and methods for selecting processes to manufacture an object23 Jun 2022US 2022/0197251 A1Paperless Parts, Inc.
- Processing instructing device, processing instructing method, computer program and processing device4 Dec 2014US 2014/0358271 A1Tokyo Electron Limited
- Substrate processing apparatus, substrate transfer method and storage medium3 Apr 2014US 2014/0093984 A1Tokyo Electron Limited
- Method and device for executing work consisting of a plurality of steps under computer control1 Feb 2007US 2007/0027563 A1INCS Inc.
- Integrated system for processing semiconductor wafers4 Jan 2007US 2007/0004316 A1
Most cited
By later US patents
- Dynamic control of wafer processing paths in semiconductor manufacturing processes46US 6,950,716 B2APPLIED Materials.Inc. · 2005
- Realtime decision making system for reduction of time delays in an automated material handling system31US 6,308,107 B1Advanced Micro Devices, Inc. · 2001
- Lot start agent that determines virtual WIP time including an exponentially weighted moving average cycle time12US 6,725,113 B1Advanced Micro Devices, Inc. · 2004
- Visualizing methods for dispatch and diagnosis of finite machines for semiconductor's manufacturing10US 6,230,068 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2001
- Method and apparatus for controlling the flow of wafers through a process flow7US 6,675,058 B1Advanced Micro Devices, Inc. · 2004