Dynamic control of wafer processing paths in semiconductor manufacturing processes

A semiconductor fabrication system, comprising:

• a first semiconductor fabrication tool;
• wherein the first semiconductor fabrication tool includes a first chamber configured to perform at least one process on a semiconductor wafer;
• a software application, in communication with the first semiconductor fabrication tool, configured to determine first specified qualities of the first chamber in performing the at least one process,
• wherein the first specified qualities include:
• a processing time required to perform the at least one process, a rate of producing defective output products of the at least one process, a uniformity of output products of the at least one process, and a capability index of the at least one process of the first chamber;
• and
• a second chamber configured to perform at least one process on a semiconductor wafer;
• wherein the software application is further configured to determine second specified qualities of the second chamber in performing the at least one process,
• wherein the second specified qualities include:
• a processing time required to perform the at least one process of the second chamber, a rate of producing defective output products of the at least one process of the second chamber, a uniformity of output products of the at least one process of the second chamber, and a capability index of the at least one process of the second chamber, and
• wherein the software application is further configured to receive a request from an external application to qualify the first and second chambers for a first requested process and make accessible information relating to the first and second specified qualities of the first and second chambers.