G05B 2219/31307
Identification structure is partly a copy of operating structure
G05B2219/31307 (Identification structure is partly a copy of operating structure) appears on 10 US grants and 9 published applications in this corpus.
Search patents in G05B- Granted patents
- 10
- Published applications
- 9
- Assignees
- 9
- Inventors
- 9
- Latest grant
- 16 Feb 2010
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 2 | 1 |
| 2002 | 1 | 1 |
| 2003 | 1 | 0 |
| 2004 | 0 | 2 |
| 2005 | 1 | 2 |
| 2006 | 1 | 0 |
| 2007 | 2 | 1 |
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 1 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip16 Feb 2010US 7,665,049 B2Hitachi, Ltd.
- Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip16 Oct 2007US 7,282,377 B2Hitachi, Ltd.
- Method for manufacturing an item5 Jun 2007US 7,228,192 B2Agentware Systems, Inc.
- Non-lot based method for assembling integrated circuit devices10 Oct 2006US 7,120,287 B2Micron Technology, Inc.
- Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip6 Sep 2005US 6,941,536 B2Hitachi, Ltd.
- Systems and methods using an event descriptor framework4 Aug 2016US 2016/0224020 A1Siemens Product Lifecycle Management Software Inc.
- Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip31 Jan 2008US 2008/0028349 A1Hitachi, Ltd.
- Non-lot based method for assembling integrated circuit devices19 Apr 2007US 2007/0086644 A1
- Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip1 Dec 2005US 2005/0263605 A1Hitachi, Ltd.
- Method for manufacturing an item7 Jul 2005US 2005/0149216 A1Agentware Systems, Inc.
Most cited
By later US patents
- Non-lot based method for assembling integrated circuit devices42US 6,049,624 AMicron Technology, Inc. · 2000
- Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip35US 6,941,536 B2Hitachi, Ltd. · 2005
- Non-lot based method for assembling integrated circuit devices25US 6,226,394 B1Micron Tecnology, Inc. · 2001
- Nonlot based method for assembling integrated circuit devices22US 6,588,854 B2Micron Technology, Inc. · 2003
- Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip22US 7,282,377 B2Hitachi, Ltd. · 2007