Non-lot based method for assembling integrated circuit devices

A method of manufacturing a plurality of integrated circuit devices, the method comprising:

• providing a plurality of fabrication substrates in multiple lots;
• fabricating a plurality of integrated circuit dice on each of the fabrication substrate of the plurality of fabrication substrates;
• separating each integrated circuit die of the plurality of integrated circuit dice on each fabrication substrate of the plurality of fabrication substrates from its fabrication substrate to form one integrated circuit die of a plurality of integrated circuit dice;
• providing a plurality of mounting substrates, each mounting substrate of the plurality of mounting substrates marked with a substantially unique mounting substrate identification code;
• providing a front-end identification code associated with each substantially unique mounting substrate identification code associated with the each integrated circuit die of the plurality of integrated circuit dice;
• reading a front-end identification code associated with the each integrated circuit die of the plurality of integrated circuit dice;
• reading the substantially unique mounting substrate identification code marked on the each mounting substrate of the plurality of mounting substrates;
• attaching the each integrated circuit die of the plurality of integrated circuit dice to one mounting substrate of the plurality of mounting substrates to form one integrated circuit device of a plurality of integrated circuit devices;
• storing the front-end identification code of the each integrated circuit die of the plurality of integrated circuit dice in each integrated circuit device of the plurality of integrated circuit devices in association with the substantially unique mounting substrate identification code of the each mounting substrate of the plurality of mounting substrates to which the each integrated circuit die of the plurality of integrated circuit dice is attached;
• advancing the each integrated circuit device of the plurality of integrated circuit devices through assembly including:
• advancing the plurality of integrated circuit devices through at least one assembly step in a substantially continuous manner;
• generating data related to the advancement of the each integrated circuit device of the plurality of integrated circuit devices through the assembly step;
• and
• associating the data generated for the each integrated circuit device of the plurality of integrated circuit devices with the substantially unique mounting substrate identification code of the each mounting substrate of the plurality of mounting substrates of the each integrated circuit device of the plurality of integrated circuit devices so the plurality of integrated circuit devices may be tracked through the assembly step;
• and
• back-end testing the each integrated circuit device of the plurality of integrated circuit devices.

A method of manufacturing multi-chip integrated circuit devices, the method comprising:

• providing a plurality of fabrication substrates in multiple lots;
• fabricating a plurality of integrated circuit dice on each fabrication substrate of the plurality of fabrication substrates;
• separating each integrated circuit die of the plurality of integrated circuit dice on the each fabrication substrate of the plurality of fabrication substrates from its fabrication substrate to form one integrated circuit die of a plurality of integrated circuit dice;
• providing a plurality of mounting substrates, each mounting substrate marked with a substantially unique mounting substrate identification code;
• providing a front-end identification code associated with each substantially unique mounting substrate identification code associated with the each integrated circuit die of the plurality of integrated circuit dice;
• reading a front-end identification code associated with the each integrated circuit die of the plurality of integrated circuit dice;
• reading a mounting substrate identification code marked on the each mounting substrate of the plurality of mounting substrates;
• attaching more than one integrated circuit die of the plurality of integrated circuit dice to the each mounting substrate of the plurality of mounting substrates to form a plurality of multi-chip integrated circuit devices;
• storing the front-end identification code of the each integrated circuit die of the plurality of integrated circuit dice in each multi-chip integrated circuit device of the plurality of multi-chip integrated circuit devices in association with the substantially unique mounting substrate identification code of the each mounting substrate of the plurality of mounting substrates to which the each integrated circuit die of the plurality of integrated circuit dice is attached;
• advancing the each multi-chip integrated circuit device of the plurality of multi-chip integrated circuit devices through assembly including:
• advancing the plurality of multi-chip integrated circuit devices through at least one assembly step in a substantially continuous manner;
• generating data related to the advancement of the each multi-chip integrated circuit device of the plurality of multi-chip integrated circuit devices through the at least one assembly step;
• and
• associating the data generated for the each multi-chip integrated circuit device of the plurality of multi-chip integrated circuit devices with the substantially unique mounting substrate identification code of the each mounting substrate of plurality of mounting substrates the each multi-chip integrated circuit device of the plurality of multi-chip integrated circuit devices so the plurality of multi-chip integrated circuit devices may be tracked through the assembly step;
• and
• back-end testing the each multi-chip integrated circuit device of the plurality of multi-chip integrated circuit devices.

A method of locating an individual integrated circuit die of a plurality integrated circuit device having at least one integrated circuit die on an integrated circuit device manufacturing line on which a multitude of integrated circuit devices are being manufactured, the method comprising:

• marking a mounting substrate of the at least one integrated circuit die of the plurality of integrated circuit devices with a substantially unique, optically-readable mounting substrate identification code;
• advancing the plurality of integrated circuit devices through assembly in multiple lots;
• and
• when one integrated circuit device of the plurality of integrated circuit devices is being processed by an assembly-related machine, reading the substantially unique, optically readable mounting substrate identification code associated with the at least one integrated circuit die of the integrated circuit device and storing the substantially unique, optically readable identification code in association with a machine identification number of the assembly-related machine;
• when the one integrated circuit device of the plurality of integrated circuit devices is stored in an integrated circuit device carrier, reading the substantially unique, optically readable mounting substrate identification code associated with the at least one integrated circuit die of the integrated circuit device and storing the substantially unique, optically readable identification code in association with a carrier identification number of the integrated circuit device carrier;
• reading the carrier identification numbers of the integrated circuit device carriers in which the integrated circuit devices are stored and storing the carrier identification numbers in association with a location code identifying a location of the integrated circuit device carriers on a manufacturing line;
• and
• when the individual integrated circuit device is stored in the integrated circuit device carrier, locating the individual integrated circuit device on the manufacturing line by accessing the carrier identification number stored in association with the substantially unique, optically readable mounting substrate identification code of the at least one integrated circuit die of the individual integrated circuit device and by accessing the location code stored in association with the accessed carrier identification number;
• and
• when the individual integrated circuit device is being processed by an assembly-related machine, locating the individual integrated circuit device on the manufacturing line by accessing a machine identification number stored in association with the substantially unique, optically readable mounting substrate identification code of the at least one integrated circuit die of the individual integrated circuit device.