Nonlot based method for assembling integrated circuit devices

A manufacturing method comprising:

• providing a plurality of first substrates in multiple lots;
• fabricating a plurality of integrated circuit dice on each first substrate of the plurality of first substrates;
• separating each integrated circuit die of the plurality of integrated circuit dice on each first substrate of the plurality of first substrates, forming one integrated circuit die of a plurality of integrated circuit dice;
• providing a plurality of mounting substrates, each mounting substrate of the plurality of mounting substrates marked with a substantially unique identification code;
• providing a front-end identification code associated with each integrated circuit die of the plurality of integrated circuit dice;
• reading the front-end identification code associated with each integrated circuit die of the plurality of integrated circuit dice;
• reading the substantially unique identification code marked on each mounting substrate of the plurality of mounting substrates;
• attaching each integrated circuit die of the plurality of integrated circuit dice to one mounting substrate of the plurality of mounting substrates, forming an integrated circuit device of a plurality of integrated circuit devices;
• storing the front-end identification code associated with each integrated circuit die of the plurality of integrated circuit dice in each integrated circuit device of the plurality of integrated circuit devices in association with the substantially unique identification code of an associated mounting substrate of the plurality of mounting substrates;
• performing an assembly step on each integrated circuit device of the plurality of integrated circuit devices including:
• advancing the plurality of integrated circuit devices through at least one assembly step in a substantially continuous manner;
• generating data related to the advancement of the plurality of integrated circuit devices through the at least one assembly step;
• and
• associating the data generated for each integrated circuit device of the plurality of integrated circuit devices with the substantially unique identification code of an associated mounting substrate of the plurality of mounting substrates so the plurality of integrated circuit devices may be tracked through the assembly step;
• and
• back-end testing each integrated circuit device of the plurality of integrated circuit devices.

A manufacturing method comprising:

• providing a plurality of wafers in multiple lots;
• fabricating a plurality of integrated circuit dice on each wafer of the plurality of wafers;
• separating each integrated circuit die of the plurality of integrated circuit dice on each wafer of the plurality of wafers from its wafer, forming one integrated circuit die of a plurality of integrated circuit dice;
• providing a plurality of mounting substrates, each mounting substrate of the plurality marked with a substantially unique identification code;
• providing a front-end identification code associated with each integrated circuit die of the plurality of integrated circuit dice;
• reading the front-end identification code associated with each integrated circuit die of the plurality of integrated circuit dice;
• reading the substantially unique identification code marked on each mounting substrate of the plurality of mounting substrates;
• attaching more than one integrated circuit die of the plurality of integrated circuit dice to each mounting substrate of the plurality of mounting substrates, forming a plurality of multichip integrated circuit devices;
• storing the front-end identification code of each integrated circuit die of the plurality of integrated circuit dice in each multichip integrated circuit device of the plurality of multichip integrated circuit devices in association with the substantially unique identification code of an associated mounting substrate of the plurality of mounting substrates;
• performing an assembly step for each multichip integrated circuit device of the plurality of multichip integrated circuit devices including:
• advancing the plurality of multichip integrated circuit devices through at least one assembly step in a substantially continuous manner;
• generating data related to the advancement of each multichip integrated circuit device of the plurality of multichip integrated circuit devices through the at least one assembly step;
• and
• associating the data generated for each multichip integrated circuit device of the plurality of multichip integrated circuit devices with the substantially unique identification code of each mounting substrate of plurality of mounting substrates so the plurality of multichip integrated circuit devices may be tracked through the assembly step;
• and
• back-end testing each multichip integrated circuit device of the plurality of multichip integrated circuit devices.

A method for locating at least one integrated circuit die in a plurality of integrated circuit devices, each integrated circuit device of the plurality of integrated circuit devices having the at least one integrated circuit die comprising:

• marking a mounting substrate of the at least one integrated circuit die with a substantially unique, optically readable identification code;
• advancing the plurality of integrated circuit devices through assembly in multiple lots while reading the substantially unique, optically readable identification code of the mounting substrate associated with the at least one integrated circuit die and storing the substantially unique, optically readable mounting substrate identification code in association with a machine identification number of an assembly related machine and when the at least one integrated circuit die is stored in an integrated circuit device carrier, reading the substantially unique, optically readable mounting substrate identification code associated with the at least one integrated circuit die and storing the substantially unique, optically readable mounting substrate identification code in association with a carrier identification number of the integrated circuit device carrier;
• and
• reading the carrier identification number of the integrated circuit device carrier and storing the carrier identification number in association with a location code identifying a location of the integrated circuit device carrier on a manufacturing line when the at least one integrated circuit device is stored in the integrated circuit device carrier, locating the at least one integrated circuit device on the manufacturing line by accessing the carrier identification number stored in association with the substantially unique, optically readable identification code of the mounting substrate of the at least one integrated circuit die and by accessing the location code stored in association with an accessed carrier identification number and when the at least one integrated circuit device is being processed by the assembly related machine, locating the at least one integrated circuit device on the manufacturing line by accessing the machine identification number stored in association with the substantially unique, optically readable identification code of the mounting substrate of the at least one integrated circuit die.