G02B 6/4253
By embedding housing components in an adhesive or a polymer material
Official title: {by embedding housing components in an adhesive or a polymer material (G02B6/4212 takes precedence)}
G02B6/4253 (By embedding housing components in an adhesive or a polymer material) appears on 206 US grants and 202 published applications in this corpus.
Search patents in G02B- Granted patents
- 206
- Published applications
- 202
- Assignees
- 130
- Inventors
- 559
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 4 | 0 |
| 1993 | 0 | 0 |
| 1994 | 4 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 4 | 0 |
| 1999 | 3 | 0 |
| 2000 | 3 | 0 |
| 2001 | 18 | 14 |
| 2002 | 13 | 13 |
| 2003 | 12 | 20 |
| 2004 | 15 | 5 |
| 2005 | 14 | 13 |
| 2006 | 10 | 7 |
| 2007 | 3 | 3 |
| 2008 | 7 | 3 |
| 2009 | 2 | 5 |
| 2010 | 2 | 5 |
| 2011 | 5 | 5 |
| 2012 | 3 | 2 |
| 2013 | 6 | 3 |
| 2014 | 3 | 10 |
| 2015 | 7 | 1 |
| 2016 | 5 | 11 |
| 2017 | 8 | 5 |
| 2018 | 7 | 10 |
| 2019 | 8 | 6 |
| 2020 | 6 | 7 |
| 2021 | 5 | 6 |
| 2022 | 4 | 11 |
| 2023 | 5 | 10 |
| 2024 | 9 | 9 |
| 2025 | 5 | 8 |
| 2026 | 3 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Optical module29 Sep 2026US 12,748,272 B2Sumitomo Electric Industries, Ltd.
- Electronic devices with molded polymer structures12 May 2026US 12,628,293 B2
- Optical connection structures for a photonic assembly and methods for forming the same17 Feb 2026US 12,554,080 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Immersion compatible optical interconnect7 Oct 2025US 12,436,345 B2Intel Corporation
- Semiconductor package and method of forming the same1 Apr 2025US 12,266,673 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Molded fiber connector assembly for pluggable optical mcp24 Sep 2026US 2026/0287837 A1Altera Corporation
- Sealed optical transceiver27 Aug 2026US 2026/0251864 A1Samtec, Inc.
- Optical communication device using conformal coating layer as optical waveguide27 Aug 2026US 2026/0255474 A1LG Energy Solution, Ltd.
- Semiconductor Device and Method of Making a Vertical Rigid-Flex Co-Packaged Optics Module13 Aug 2026US 2026/0240003 A1STATS ChipPAC Management Pte. Ltd.
- Photonic integrated circuit packaging architectures30 Jul 2026US 2026/0219459 A1Intel Corporation
Most cited
By later US patents
- Optical transmission terminal device160US 5,960,141 AFujitsu Limited · 1999
- Optical transceiver86US 10,333,623 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2019
- Packaging platform, optical module using the platform, and methods for producing the platform and the module60US 6,222,967 B1Nippon Telegraph and Telephone Corporation · 2001
- Encapsulation of optoelectronic components58US 5,818,990 ATelefonaktiebolaget LM Ericsson · 1998
- Optical device56US 6,530,698 B1Sumitomo Electric Industries, Ltd. · 2003