Photonic integrated circuit packaging architectures

A multi-layer assembly, comprising:

• a circuit board;
• an integrated circuit (IC) over the circuit board;
• a photonic integrated circuit (PIC) over the circuit board, the PIC coupled with the IC and having a first side and a second side;
• and
• a processor die coupled with the PIC,
• wherein:
• the PIC is between the circuit board and the IC,
• a footprint of the IC overlaps with a footprint of the PIC,
• the PIC includes an optical structure on the first side,
• the optical structure includes a waveguide, an optical modulator, a photodetector, and a phase shifter,
• an optical output of the PIC is at the second side of the photonic die, and
• the first side intersects the second side.

A photonic package, comprising:

• a circuit board;
• an integrated circuit (IC);
• an insulating material;
• a photonic IC (PIC) having a first side, a second side substantially perpendicular to the first side, and a third side opposite the first side;
• and
• an optical coupler coupled with the PIC on the second side of the PIC,
• wherein:
• a distance between the first side of the PIC and the IC is smaller than a distance between the third side of the PIC and the IC,
• at least one optical structure is over the first side of the PIC,
• the insulating material is between the PIC and the IC,
• a portion of the first side of the PIC is in contact with the insulating material,
• a conductive interconnect extends through the insulating material and is conductively coupled with the PIC and with the IC, and
• the PIC is electrically coupled with the circuit board and with the IC.