Packaging platform, optical module using the platform, and methods for producing the platform and the module
AssigneeNippon Telegraph and Telephone Corporation
InventorsMichiyuki Amano, Shunichi Tono, Hirotsugu Sato, Yasuaki Tamura, Yoshito Shuto, Kenji Yokoyama, Haruki Kozawaguchi, Makoto Hikita, Ryoko Yoshimura, Satoru Tomaru, Saburo Imamura, Toshikazu Hashimoto, Yasufumi Yamada, Kuniharu Kato, Masahiro Yanagisawa, Akio Sugita
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