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US 12,436,345 B2Granted
Immersion compatible optical interconnect
AssigneeIntel Corporation
InventorDivya Pratap
Life of this patent
Estimating the term…
Abstract
A fluid compatible electro-optical packages and associated systems and devices are shown. For example, a fluid compatible electro-optical package includes integrated circuits with at least one photonic die and optical connections coupled with the integrated circuit. In an example, optical fibers are coupled with the optical connection. In an example fluid compatible electro-optical package, a fluid impermeable port is coupled with the optical connection and the optical fibers couple with the optical connection within the fluid impermeable port.
Claims20
An apparatus, comprising:
- an integrated circuit comprising at least one photonic die;
- an optical connection coupled with the integrated circuit;
- optical fibers coupled with the optical connection;
- a fluid impermeable port coupled with the optical connection, the fluid impermeable port comprising a polymer-based material and having a fluid impermeable port latch comprising the polymer-based material;
- and
- an adapter coupled to the fluid impermeable port, the adapter comprising an adapter latch engaged with the fluid impermeable port, wherein the optical fibers couple with the optical connection within the fluid impermeable port.
3 more elements
An apparatus, comprising:
- a photonic silicon die coupled to a substrate;
- an integrated heat spreader covering the photonic silicon die and comprising a cutout;
- optical fibers in communication with the photonic silicon die through the cutout;
- a compressible seal surrounding the optical fibers at a communication point with the photonic silicon die, the compressible seal comprising a polymer-based material and having a fluid impermeable port latch comprising the polymer-based material;
- and
- a latching mechanism engaged with the fluid impermeable port latch of the compressible seal, wherein the compression force provided to the compressible seal is a fluid barrier at the communication point.
3 more elements
An apparatus, comprising:
- a photonic die coupled to a substrate;
- an integrated heat spreader covering the die;
- optical fibers in communication with the photonic die;
- a port surrounding the optical fibers at a communication point with the photonic die, the port comprising a polymer-based material and having a first latch comprising the polymer-based material;
- and
- an adapter coupled to the integrated heat spreader, the adapter comprising a second latch engaged with the first latch, wherein the port, the first latch, and the second latch provide a fluid barrier at the communication point.
3 more elements
Dependencies are inferred from the claim text.