G02B 3/0018
Reflow, i.e. characterized by the step of melting microstructures to form curved
Official title: {Reflow, i.e. characterized by the step of melting microstructures to form curved surfaces, e.g. manufacturing of moulds and surfaces for transfer etching}
G02B3/0018 (Reflow, i.e. characterized by the step of melting microstructures to form curved) appears on 227 US grants and 258 published applications in this corpus.
Search patents in G02B- Granted patents
- 227
- Published applications
- 258
- Assignees
- 148
- Inventors
- 530
- Latest grant
- 2 Dec 2025
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| Year | Granted patents | Published applications |
|---|---|---|
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| 1992 | 1 | 0 |
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| 2002 | 6 | 13 |
| 2003 | 12 | 7 |
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| 2008 | 13 | 18 |
| 2009 | 14 | 16 |
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| 2011 | 8 | 10 |
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| 2024 | 8 | 4 |
| 2025 | 8 | 4 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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By later US patents
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