G02B 2006/12176
Etching
Official title: {Etching}
G02B2006/12176 (Etching) appears on 613 US grants and 586 published applications in this corpus.
Search patents in G02B- Granted patents
- 613
- Published applications
- 586
- Assignees
- 310
- Inventors
- 1,295
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 10 | 0 |
| 1995 | 9 | 0 |
| 1996 | 11 | 0 |
| 1997 | 11 | 0 |
| 1998 | 15 | 0 |
| 1999 | 12 | 0 |
| 2000 | 15 | 0 |
| 2001 | 16 | 8 |
| 2002 | 21 | 37 |
| 2003 | 33 | 71 |
| 2004 | 37 | 28 |
| 2005 | 36 | 32 |
| 2006 | 36 | 21 |
| 2007 | 16 | 11 |
| 2008 | 12 | 2 |
| 2009 | 11 | 3 |
| 2010 | 6 | 3 |
| 2011 | 3 | 3 |
| 2012 | 0 | 4 |
| 2013 | 7 | 14 |
| 2014 | 12 | 20 |
| 2015 | 12 | 23 |
| 2016 | 20 | 21 |
| 2017 | 21 | 20 |
| 2018 | 22 | 17 |
| 2019 | 23 | 31 |
| 2020 | 31 | 34 |
| 2021 | 26 | 33 |
| 2022 | 28 | 33 |
| 2023 | 24 | 32 |
| 2024 | 26 | 39 |
| 2025 | 35 | 20 |
| 2026 | 12 | 26 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Optical interposer structure and method11 Aug 2026US 12,704,675 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor devices with embedded silicon lens4 Aug 2026US 12,699,223 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of fabricating molds for forming eyepieces with integrated spacers14 Jul 2026US 12,679,057 B2Magic Leap, Inc.
- Microfabrication technique for structuring non-planar electromagnetic waveguides30 Jun 2026US 12,669,649 B2Fondazione Istituto Italiano Di Tecnologia
- Opto-electronic device16 Jun 2026US 12,658,677 B2Nokia Solutions and Networks Oy
- Method of fabricating molds for forming eyepieces with integrated spacers8 Oct 2026US 2026/0307347 A1Magic Leap, Inc.
- Distributed bragg grating with ultralow index perturbation8 Oct 2026US 2026/0309915 A1University of Rochester
- Laminate, method for manufacturing laminate, and method for manufacturing semiconductor device24 Sep 2026US 2026/0293604 A1Toray Industries, Inc.
- Pluggable chip interposer for photonic chip alignment17 Sep 2026US 2026/0276915 A1University of Rochester
- Multi-tiered semiconductor waveguide and multi-tiered waveguide heater3 Sep 2026US 2026/0259367 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Structure and method for planar lateral oxidation in passive devices196US 6,548,908 B2Xerox Corporation · 2003
- Reconfigurable and scalable intergrated optic waveguide add/drop multiplexing element using micro-opto-electro-mechanical systems and methods of fabricating thereof190US 6,363,183 B12002
- Composite waveguide for solid phase binding assays163US 5,832,165 AUniversity of Utah Research Foundation · 1998
- Unitary microcapiliary and waveguide structure and method of fabrication140US 6,438,279 B1Cornell Research Foundation, Inc. · 2002
- Method and apparatus for providing a seamless electrical/optical multi-layer micro-opto-electro-mechanical system assembly133US 5,761,350 A1998