G01P 2015/0805
Being provided with a particular type of spring-mass-system for defining the displacement
Official title: {being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration}
G01P2015/0805 (Being provided with a particular type of spring-mass-system for defining the displacement) appears on 1,988 US grants and 1,661 published applications in this corpus.
Search patents in G01P- Granted patents
- 1,988
- Published applications
- 1,661
- Assignees
- 497
- Inventors
- 2,605
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 5 | 0 |
| 1986 | 5 | 0 |
| 1987 | 9 | 0 |
| 1988 | 8 | 0 |
| 1989 | 15 | 0 |
| 1990 | 17 | 0 |
| 1991 | 12 | 0 |
| 1992 | 28 | 0 |
| 1993 | 29 | 0 |
| 1994 | 40 | 0 |
| 1995 | 51 | 0 |
| 1996 | 61 | 0 |
| 1997 | 60 | 0 |
| 1998 | 55 | 0 |
| 1999 | 56 | 0 |
| 2000 | 68 | 0 |
| 2001 | 71 | 24 |
| 2002 | 51 | 45 |
| 2003 | 53 | 60 |
| 2004 | 56 | 78 |
| 2005 | 66 | 72 |
| 2006 | 61 | 78 |
| 2007 | 47 | 70 |
| 2008 | 57 | 63 |
| 2009 | 55 | 80 |
| 2010 | 45 | 82 |
| 2011 | 46 | 80 |
| 2012 | 58 | 70 |
| 2013 | 70 | 78 |
| 2014 | 66 | 53 |
| 2015 | 59 | 81 |
| 2016 | 72 | 86 |
| 2017 | 63 | 73 |
| 2018 | 56 | 61 |
| 2019 | 74 | 75 |
| 2020 | 66 | 70 |
| 2021 | 56 | 55 |
| 2022 | 56 | 45 |
| 2023 | 56 | 67 |
| 2024 | 41 | 61 |
| 2025 | 33 | 30 |
| 2026 | 27 | 24 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- G01P 2015/0822For defining out-of-plane movement of the massIndexing code1,305
- G01P 2015/0808For defining in-plane movement of the mass, i.e. movement of the massIndexing code809
- G01P 2015/0857Using a particular shape of the suspension springIndexing code58
- G01P 2015/0848Using a plurality of mechanically coupled spring-mass systems, the sensitive direction ofIndexing code31
- G01P 2015/0845Using a plurality of spring-mass systems being arranged on one common planarIndexing code20
- G01P 2015/0854Using a particular shape of the massIndexing code14
- G01P 2015/0851Using a plurality of spring-mass systems, each system having a different rangeIndexing code8
Recent patents
- Method of fabricating micro-electromechanical system device22 Sep 2026US 12,741,865 B2Vanguard International Semiconductor Corporation
- Optical displacement sensors8 Sep 2026US 12,730,124 B2Sensibel AS
- Physical quantity sensor and inertial measurement device1 Sep 2026US 12,724,037 B2Seiko Epson Corporation
- Accelerometer with thermal expansion strain protection25 Aug 2026US 12,715,763 B2Honeywell International Inc.
- Accelerometer with proof mass displacement reduction feature25 Aug 2026US 12,716,912 B2Honeywell International Inc.
- Microelectromechanical system with improved compensation of the radiometric effect1 Oct 2026US 2026/0298965 A1STMicroelectronics International N. V.
- Accelerometer with proof mass bonding feature10 Sep 2026US 2026/0266866 A1Honeywell International Inc.
- Accelerometer9 Jul 2026US 2026/0194554 A1Safran Electronics & Defense
- Capacitive dual-axis accelerometer having z-axis and manufacturing method thereof11 Jun 2026US 2026/0160782 A1Miramems Sensing Technology Co., Ltd
- Accelerometer11 Jun 2026US 2026/0160783 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Laterally driven resonant microstructures419US 5,025,346 AThe Regents of the University of California · 1991
- Opto-electro-mechanical device or filter, process for making, and sensors made therefrom408US 5,559,358 AHoneywell Inc. · 1996
- Microelectromechanical device having a stiffened support beam, and methods of forming stiffened support beams in MEMS294US 6,632,698 B2Hewlett-Packard Development Company, L. P. · 2003
- Etchants for use in micromachining of CMOS Microaccelerometers and microelectromechanical devices and method of making the same285US 5,726,480 AThe Regents of the University of California · 1998
- Fully integrated single-crystal silicon-on-insulator process, sensors and circuits261US 5,343,064 A1994