G01N 33/0095
Semiconductive materials
Official title: {Semiconductive materials}
G01N33/0095 (Semiconductive materials) appears on 165 US grants and 169 published applications in this corpus.
Search patents in G01N- Granted patents
- 165
- Published applications
- 169
- Assignees
- 130
- Inventors
- 498
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 2 | 0 |
| 1999 | 7 | 0 |
| 2000 | 10 | 0 |
| 2001 | 11 | 0 |
| 2002 | 6 | 4 |
| 2003 | 4 | 4 |
| 2004 | 5 | 11 |
| 2005 | 9 | 4 |
| 2006 | 4 | 2 |
| 2007 | 2 | 1 |
| 2008 | 2 | 2 |
| 2009 | 3 | 3 |
| 2010 | 1 | 3 |
| 2011 | 3 | 1 |
| 2012 | 0 | 0 |
| 2013 | 1 | 2 |
| 2014 | 1 | 7 |
| 2015 | 5 | 26 |
| 2016 | 8 | 9 |
| 2017 | 15 | 7 |
| 2018 | 3 | 3 |
| 2019 | 9 | 12 |
| 2020 | 7 | 11 |
| 2021 | 9 | 9 |
| 2022 | 7 | 8 |
| 2023 | 11 | 14 |
| 2024 | 7 | 11 |
| 2025 | 5 | 13 |
| 2026 | 8 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Part, sensor, and metrology data integration29 Sep 2026US 12,748,407 B2APPLIED Materials.Inc.
- Systems and methods for recovering organic contaminants from semiconducting wafers29 Sep 2026US 12,749,667 B2Elemental Scientific, Inc.
- Apparatus for inspecting fatigue fracture of housing welding part of battery module15 Sep 2026US 12,736,449 B2LG Energy Solution, Ltd.
- Method of measuring contact angle of silicon wafer and method of evaluating surface condition of silicon wafer18 Aug 2026US 12,710,347 B2Sumco Corporation
- Systems for integrated decomposition and scanning of a semiconducting wafer18 Aug 2026US 12,713,869 B2Elemental Scientific, Inc.
- Automatic Defect Classification Analysis20 Aug 2026US 2026/0243746 A1KLA Corporation
- Semiconductor device imaging method16 Apr 2026US 2026/0104374 A1Samsung Electronics Co., Ltd.
- Method of inspecting semiconductor process and method of manufacturing semiconductor device including the same27 Nov 2025US 2025/0364287 A1Samsung Electronics Co., Ltd.
- Sample processing method and semiconductor device analysis method including the same25 Sep 2025US 2025/0297930 A1Samsung Electronics Co., Ltd.
- In-situ variable temperature bow metrology28 Aug 2025US 2025/0271374 A1Tokyo Electron Limited
Most cited
By later US patents
- Material transport method and apparatus254US 6,110,343 ALockheed Martin Energy Research Corporation · 2000
- Material transport method and apparatus77US 6,231,737 B1UT-Battelle, LLC · 2001
- Method for the calculation of wafer probe yield limits from in-line defect monitor data65US 6,324,481 B1Texas Instruments Incorporated · 2001
- Measurement of different mobile ion concentrations in the oxide layer of a semiconductor wafer55US 6,569,691 B1Semiconductor Diagnostics, Inc. · 2003
- Quartz crystal microbalance sensors and semiconductor manufacturing process systems comprising same53US 6,295,861 B1Advanced Technology Materials, Inc. · 2001