G01K 7/015
Using microstructures
Official title: {using microstructures, e.g. made of silicon}
G01K7/015 (Using microstructures) appears on 269 US grants and 279 published applications in this corpus.
Search patents in G01K- Granted patents
- 269
- Published applications
- 279
- Assignees
- 149
- Inventors
- 544
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 1 |
| 2002 | 1 | 0 |
| 2003 | 1 | 2 |
| 2004 | 3 | 5 |
| 2005 | 4 | 9 |
| 2006 | 9 | 10 |
| 2007 | 11 | 29 |
| 2008 | 22 | 45 |
| 2009 | 27 | 17 |
| 2010 | 29 | 8 |
| 2011 | 16 | 4 |
| 2012 | 8 | 4 |
| 2013 | 4 | 3 |
| 2014 | 2 | 3 |
| 2015 | 7 | 9 |
| 2016 | 5 | 5 |
| 2017 | 6 | 6 |
| 2018 | 7 | 10 |
| 2019 | 14 | 17 |
| 2020 | 5 | 10 |
| 2021 | 10 | 18 |
| 2022 | 13 | 17 |
| 2023 | 11 | 11 |
| 2024 | 21 | 13 |
| 2025 | 11 | 16 |
| 2026 | 13 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Lateral bipolar junction transistor device and method of forming same29 Sep 2026US 12,747,993 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Temperature ramp control for integrated circuit chips29 Sep 2026US 12,747,994 B1Auradine, Inc.
- Semiconductor apparatus, temperature compensation system, and alarm system8 Sep 2026US 12,733,433 B2Sony Semiconductor Solutions Corporation
- High accuracy fast voltage and temperature sensor circuit25 Aug 2026US 12,716,783 B2STMicroelectronics International N. V.
- Self heating extraction design and methodology with power consumption correction18 Aug 2026US 12,710,319 B2International Business Machines Corporation
- Temperature sensing apparatus and method having calibration mechanism13 Aug 2026US 2026/0235453 A1Realtek Semiconductor Corp.
- Thermal detector of electromagnetic radiation comprising a thermometer diode6 Aug 2026US 2026/0227241 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Semiconductor device28 May 2026US 2026/0150666 A1Mitsubishi Electric Corporation
- Biometric sensor comprising oxide semiconductor, biometric sensor on display, and methods of making and using the same26 Mar 2026US 2026/0087844 A1NEXT Biometrics Group ASA
- Biometric sensor comprising oxide semiconductor, biometric sensor on display, and methods of making and using the same29 Jan 2026US 2026/0026714 A1NEXT Biometrics Group ASA
Most cited
By later US patents
- Method and apparatus for sensing and transmitting a body characteristic of a host192US 7,015,826 B1Digital Angel Corporation · 2006
- System-on-a-chip integrated circuit including dual-function analog and digital inputs131US 7,129,746 B1Actel Corporation · 2006
- Programmable system on a chip104US 7,170,315 B2Actel Corporation · 2007
- Multiple detecting apparatus for physical phenomenon and/or chemical phenomenon72US 6,294,133 B1Horiba, Ltd. · 2001
- Suspended single crystal silicon structures and method of making same65US 5,600,174 AThe Board of Trustees of the Leeland Stanford Junior University · 1997