G01J 5/0007
Of wafers or semiconductor substrates
Official title: {of wafers or semiconductor substrates, e.g. using Rapid Thermal Processing}
G01J5/0007 (Of wafers or semiconductor substrates) appears on 255 US grants and 267 published applications in this corpus.
Search patents in G01J- Granted patents
- 255
- Published applications
- 267
- Assignees
- 123
- Inventors
- 629
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 4 | 0 |
| 1991 | 4 | 0 |
| 1992 | 8 | 0 |
| 1993 | 8 | 0 |
| 1994 | 9 | 0 |
| 1995 | 3 | 0 |
| 1996 | 5 | 0 |
| 1997 | 1 | 0 |
| 1998 | 5 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 5 | 2 |
| 2002 | 2 | 3 |
| 2003 | 6 | 4 |
| 2004 | 5 | 6 |
| 2005 | 5 | 2 |
| 2006 | 2 | 3 |
| 2007 | 1 | 0 |
| 2008 | 1 | 4 |
| 2009 | 3 | 7 |
| 2010 | 5 | 8 |
| 2011 | 4 | 6 |
| 2012 | 4 | 10 |
| 2013 | 4 | 10 |
| 2014 | 7 | 9 |
| 2015 | 8 | 11 |
| 2016 | 9 | 7 |
| 2017 | 9 | 16 |
| 2018 | 13 | 15 |
| 2019 | 13 | 13 |
| 2020 | 10 | 16 |
| 2021 | 13 | 16 |
| 2022 | 12 | 20 |
| 2023 | 12 | 20 |
| 2024 | 17 | 21 |
| 2025 | 15 | 20 |
| 2026 | 15 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Methods of forming structures, semiconductor processing systems, and semiconductor device structures22 Sep 2026US 12,742,242 B2ASM IP Holding B. V.
- In-situ wafer stress measurement by chromatic confocal sensor scanning with temperature compensation25 Aug 2026US 12,716,713 B2Orbotech Ltd.
- Systems, apparatus, and methods for monitoring plate temperature for semiconductor manufacturing25 Aug 2026US 12,716,777 B2APPLIED Materials.Inc.
- In-situ wafer stress measurement by chromatic confocal sensor scanning with vibration compensation18 Aug 2026US 12,710,265 B2Orbotech Ltd.
- Synchronization between temperature measurement device and radiation sources28 Jul 2026US 12,696,714 B2Ci Systems (Israel) Ltd.
- Chamber kits, systems, and methods for calibrating temperature sensors for semiconductor manufacturing8 Oct 2026US 2026/0309552 A1APPLIED Materials.Inc.
- Radiation temperature measurement device, radiation temperature measurement method, and program for radiation temperature measurement device1 Oct 2026US 2026/0298714 A1Horiba, Ltd.
- Automated pyrometer tracking1 Oct 2026US 2026/0298717 A1Heraeus Covantics North America LLC
- Semiconductor device defect and fault isolation1 Oct 2026US 2026/0299004 A1Intel Corporation
- Solder reflow with optical endpoint control24 Sep 2026US 2026/0293585 A1Yield Engineering Systems, Inc.
Most cited
By later US patents
- Wafer processing cluster tool batch preheating and degassing apparatus663US 5,259,881 AMaterials Research Corporation · 1993
- System of controlling the temperature of a processing chamber507US 6,191,399 B1ASM America, Inc. · 2001
- Method and apparatus for real-time wafer temperature measurement using infrared pyrometry in advanced lamp-heated rapid thermal processors473US 4,956,538 ATexas Instruments Incorporated · 1990
- Apparatus for heating semiconductor wafers in order to achieve annealing, silicide formation, reflow of glass passivation layers, etc.140US 4,649,261 ATamarack Scientific Co., Inc. · 1987
- Emissivity correction apparatus and method119US 4,919,542 AProcessing Technologies, LLC · 1990