Systems, apparatus, and methods for monitoring plate temperature for semiconductor manufacturing

A system for processing substrates and applicable for semiconductor manufacturing, the system comprising:

• a chamber body comprising one or more sidewalls;
• a lid;
• a window, the one or more sidewalls, the window, and the lid at least partially defining an internal volume, and the window comprising a first quartz;
• one or more heat sources configured to heat the internal volume;
• a substrate support disposed in the internal volume, the substrate support comprising a support surface facing the window;
• and
• a plate disposed in the internal volume between the support surface of the substrate support and the window, the plate comprising a second quartz, and the second quartz having an hydroxyl concentration of more than 750 ppm.

A system for processing substrates and applicable for semiconductor manufacturing, the system comprising:

• a chamber body comprising one or more sidewalls;
• a lid;
• a window, the one or more sidewalls, the window, and the lid at least partially defining an internal volume;
• one or more heat sources configured to heat the internal volume;
• a substrate support disposed in the internal volume;
• a plate disposed in the internal volume between the substrate support and the window;
• and
• a controller comprising instructions that, when executed, cause a plurality of operations to be conducted, the plurality of operations comprising:
• heating a substrate supported at least partially by the substrate support,
• flowing one or more process gases over the substrate to form one or more layers on the substrate,
• monitoring a first temperature of the substrate or the substrate support using a first optical sensor, and
• monitoring a second temperature of the plate using a second optical sensor.