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US 2026/0299004 A1Published application
Semiconductor device defect and fault isolation
AssigneeIntel Corporation
InventorsChandrashekara Shashank KAIRA, Denis MYASISHCHEV, Deepak GOYAL
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Abstract
A fault isolation module for detecting electrical defects through DC and/or RF thermal excitation in semiconductor devices is provided. Using a coupled thermal imaging module, thermally excited defects and thermal signatures for defects can be detected.
Claims20
A system comprising:
- a first source measurement unit and a second source measurement unit;
- an arbitrary waveform generator coupled to the first source measurement unit and a second source measurement unit wherein the arbitrary waveform generator is capable of supplying a reference trigger to an imaging module;
- a radio frequency (RF) signal generator and amplitude extender wherein the RF signal generator and amplitude extender is coupled to the arbitrary waveform generator;
- a RF multiplexer coupled to the RF signal generator and amplitude extender;
- an RF coupler coupled to the RF multiplexer;
- and
- a RF power sensor coupled to the RF coupler.
4 more elements
A method comprising:
- generating a reference trigger to synchronize a thermal imaging module with a fault isolation module;
- generating a direct current (DC) signal to thermally excite a first electrical defect in a device under test through resistive heating;
- detecting a thermal excitation of the first electrical defect in the device under test with the thermal imaging module;
- and
- determining a location of the first electrical defect in the device under test.
2 more elements
At least one machine-readable storage medium comprising non-transitory instructions, that when executed by a processor, cause a system comprising a fault isolation module and an imaging module to:
- generate reference trigger to synchronize a thermal imaging module with the fault isolation module;
- generate a direct current (DC) signal to thermally excite a first electrical defect in a device under test through resistive heating;
- detect a thermal excitation of the first electrical defect in the device under test with the imaging module;
- and
- determine a location of the electrical defect in the device under test.
2 more elements
Dependencies are inferred from the claim text.