G01C 19/5769
Manufacturing
Official title: Manufacturing; Mounting; Housings
G01C19/5769 (Manufacturing) appears on 185 US grants and 220 published applications in this corpus.
Search patents in G01C- Granted patents
- 185
- Published applications
- 220
- Assignees
- 87
- Inventors
- 418
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 0 |
| 2002 | 3 | 2 |
| 2003 | 0 | 0 |
| 2004 | 1 | 0 |
| 2005 | 0 | 2 |
| 2006 | 0 | 3 |
| 2007 | 3 | 2 |
| 2008 | 1 | 6 |
| 2009 | 3 | 1 |
| 2010 | 2 | 4 |
| 2011 | 1 | 10 |
| 2012 | 4 | 9 |
| 2013 | 10 | 19 |
| 2014 | 10 | 17 |
| 2015 | 16 | 21 |
| 2016 | 14 | 16 |
| 2017 | 17 | 12 |
| 2018 | 12 | 22 |
| 2019 | 15 | 16 |
| 2020 | 16 | 7 |
| 2021 | 10 | 8 |
| 2022 | 9 | 8 |
| 2023 | 5 | 8 |
| 2024 | 10 | 16 |
| 2025 | 6 | 6 |
| 2026 | 7 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- MEMS gyroscope with enhanced robustness against vibrations and reduced dimensions29 Sep 2026US 12,747,946 B2STMicroelectronics S,r.l.
- Microelectromechanical systems package with a lateral vent hole connected to a cavity and method for manufacturing the same22 Sep 2026US 12,741,863 B2Vanguard International Semiconductor Corporation
- Sensor and electronic device18 Aug 2026US 12,710,271 B2Kabushiki Kaisha Toshiba
- Inertial sensor, method for manufacturing inertial sensor, and inertial measurement unit19 May 2026US 12,631,665 B2Seiko Epson Corporation
- Manufacturing method for electronic device and electronic device12 May 2026US 12,624,949 B2Seiko Epson Corporation
- Silicon mems gyroscopes with upper and lower sense plates30 Apr 2026US 2026/0118125 A1The Charles Stark Draper Laboratory, Inc.
- Mechanically amplified high-precision, high-stability angular rate sensors23 Apr 2026US 2026/0110537 A1Shanghai Roadix Technology Co., Ltd
- Electronic Structure, Inertial Measurement Unit, Electronic Apparatus, And Moving Object12 Mar 2026US 2026/0070779 A1Seiko Epson Corporation
- Resonant mems device12 Mar 2026US 2026/0071873 A1Motion Engine Inc.
- Method for manufacturing a vibratory mechanical inertial sensor, sensor obtained by such a method and inertial unit including such a sensor15 Jan 2026US 2026/0015224 A1Jxsens
Most cited
By later US patents
- Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics153US 8,250,921 B2InvenSense, Inc. · 2012
- Method of fabricating micro electro mechanical system structure which can be vacuum-packed at wafer level88US 6,391,673 B1Samsung Electronics Co., Ltd. · 2002
- MEMS integrated pressure sensor devices and methods of forming same66US 9,040,334 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Process for producing a speed of rotation coriolis sensor44US 6,214,243 B1Robert Bosch GmbH · 2001
- Method for manufacturing a rate-of-rotation sensor39US 6,117,701 ARobert Bosch GmbH · 2000