G01B 11/0683
Measurement during deposition or removal of the layer
Official title: {measurement during deposition or removal of the layer}
G01B11/0683 (Measurement during deposition or removal of the layer) appears on 361 US grants and 341 published applications in this corpus.
Search patents in G01B- Granted patents
- 361
- Published applications
- 341
- Assignees
- 179
- Inventors
- 752
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 6 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 8 | 0 |
| 1996 | 1 | 0 |
| 1997 | 6 | 0 |
| 1998 | 11 | 0 |
| 1999 | 12 | 0 |
| 2000 | 13 | 0 |
| 2001 | 12 | 5 |
| 2002 | 7 | 12 |
| 2003 | 14 | 9 |
| 2004 | 10 | 19 |
| 2005 | 9 | 18 |
| 2006 | 16 | 10 |
| 2007 | 10 | 16 |
| 2008 | 12 | 14 |
| 2009 | 12 | 14 |
| 2010 | 17 | 21 |
| 2011 | 7 | 12 |
| 2012 | 9 | 12 |
| 2013 | 10 | 7 |
| 2014 | 10 | 11 |
| 2015 | 8 | 12 |
| 2016 | 8 | 10 |
| 2017 | 7 | 7 |
| 2018 | 11 | 16 |
| 2019 | 8 | 11 |
| 2020 | 8 | 15 |
| 2021 | 14 | 22 |
| 2022 | 19 | 19 |
| 2023 | 11 | 16 |
| 2024 | 12 | 12 |
| 2025 | 11 | 13 |
| 2026 | 13 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Film thickness measuring device and film thickness measuring method22 Sep 2026US 12,742,637 B2Hamamatsu Photonics K.K.
- Method and apparatus for micromachining a sample using a focused ion beam21 Jul 2026US 12,687,386 B2Delmic IP B.V.
- Coating thickness measuring device and coating device including the same30 Jun 2026US 12,669,323 B2LG Chem.Ltd.
- Polishing apparatus and polishing method14 Apr 2026US 12,600,007 B2Ebara Corporation
- Endpoint detection method for chamber component refurbishment14 Apr 2026US 12,601,585 B2ASM IP Holding B. V.
- Polishing apparatus and polishing method20 Aug 2026US 2026/0241513 A1Ebara Corporation
- Measurement of melt pool position in additive manufacturing2 Jul 2026US 2026/0185820 A1Nikon Corporation
- Endpoint detection method for chamber component refurbishment25 Jun 2026US 2026/0177376 A1ASM IP Holding B. V.
- Coating system and coating method4 Jun 2026US 2026/0151788 A1Contemporary Amperex Technology Co., Limited
- Method, control device, computer program and storage medium30 Apr 2026US 2026/0117367 A1Von Ardenne Asset GmbH & Co. KG
Most cited
By later US patents
- In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing472US 5,433,651 AInternational Business Machines Corporation · 1995
- Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus396US 5,893,796 AAPPLIED Materials.Inc. · 1999
- Apparatus and method for in-situ monitoring of chemical mechanical polishing operations261US 5,964,643 AAPPLIED Materials.Inc. · 1999
- Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers230US 5,663,797 AMicron Technology, Inc. · 1997
- Apparatus and method for real-time measurement of thin film layer thickness and changes thereof206US 5,450,205 AMassachusetts Institute of Technology · 1995