F28F 21/085
From copper or copper alloys
Official title: {from copper or copper alloys}
F28F21/085 (From copper or copper alloys) appears on 237 US grants and 364 published applications in this corpus.
Search patents in F28F- Granted patents
- 237
- Published applications
- 364
- Assignees
- 239
- Inventors
- 900
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 3 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 9 | 0 |
| 2000 | 4 | 0 |
| 2001 | 2 | 1 |
| 2002 | 3 | 3 |
| 2003 | 2 | 4 |
| 2004 | 4 | 4 |
| 2005 | 1 | 7 |
| 2006 | 2 | 4 |
| 2007 | 0 | 10 |
| 2008 | 1 | 1 |
| 2009 | 1 | 7 |
| 2010 | 1 | 8 |
| 2011 | 2 | 10 |
| 2012 | 1 | 4 |
| 2013 | 3 | 13 |
| 2014 | 7 | 7 |
| 2015 | 4 | 16 |
| 2016 | 8 | 23 |
| 2017 | 12 | 30 |
| 2018 | 17 | 21 |
| 2019 | 19 | 34 |
| 2020 | 26 | 29 |
| 2021 | 18 | 27 |
| 2022 | 18 | 21 |
| 2023 | 13 | 33 |
| 2024 | 14 | 16 |
| 2025 | 14 | 10 |
| 2026 | 7 | 21 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multifunctional surface structure for condensation enhancement and preparation method and use thereof11 Aug 2026US 12,704,334 B1Guangzhou Institute of Technology, Xidian University
- Vapor chamber with support structure30 Jun 2026US 12,669,293 B2Delta Electronics, Inc.
- Heat transfer structure of divertor23 Jun 2026US 12,665,095 B2Hefei Institutes of Physical Science, Chinese Academy of Sciences
- Integrated heat dissipation module structure12 May 2026US 12,628,314 B2Top Rank Technology Limited
- Copper paste, wick formation method, and heat pipe10 Feb 2026US 12,544,832 B2Resonac Corporation
- Multimaterial heat-transfer systems with controlled interface behavior1 Oct 2026US 2026/0298508 A1
- Nonlinear thermal transport mitigation system incorporating copper dense-mass nodes to stabilize transient temperature perturbations17 Sep 2026US 2026/0276253 A1
- Heterogeneous thermal inertia architectures for controlled enclosures17 Sep 2026US 2026/0276258 A1
- Heat dissipation apparatus23 Jul 2026US 2026/0210643 A1Kmw Inc.
- Thermal management planes23 Jul 2026US 2026/0210644 A1Kelvin Thermal Technologies, Inc.
Most cited
By later US patents
- Modular microchannel heat exchanger201US 5,727,618 A1998
- Low vibration cryocooled system for low temperature microscopy and spectroscopy applications108US 8,746,008 B1Montana Instruments Corporation · 2014
- Small volume heat sink/electronic assembly106US 6,031,751 AReliance Electric Industrial Company · 2000
- Electroformed high efficiency heat exchanger and method for making69US 5,199,487 AHughes Aircraft Company · 1993
- Cryogenic heat exchanger57US 5,901,783 ACroyogen, Inc. · 1999