Integrated heat dissipation module structure
AssigneeTop Rank Technology Limited
InventorsTien-Lai Wang, Tzu-Yu Wang, Cheng-Yu Wang, Meng-Yu Lee
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AssigneeTop Rank Technology Limited
InventorsTien-Lai Wang, Tzu-Yu Wang, Cheng-Yu Wang, Meng-Yu Lee
Estimating the term…
An integrated heat dissipation module structure includes a metallic top cover, a metallic bottom cover, a working space, capillary structures and a working fluid in the working space. The top cover includes oppositely an outer heat-dissipating surface having a plurality of columnar heat dissipation structures protruding therefrom and an inner condensation surface surrounded by a top frame. The inner condensation surface has parallel top grooves. The bottom cover includes oppositely an outer heat-absorption surface having screw holes for locking electronic elements and an inner evaporation surface surrounded by a bottom frame. The inner evaporation surface has parallel bottom grooves, protrusive supporting structures disposed between the bottom grooves, and screw-hole protrusions corresponding to the screw holes. The capillary structures are disposed within the bottom grooves or both the bottom and top grooves. The working fluid is in the working space and the capillary structures.
An integrated heat dissipation module structure, comprising:
An integrated heat dissipation module structure, comprising:
Dependencies are inferred from the claim text.