Heat dissipation apparatus

A heat dissipation apparatus comprising:

• a first-side heat-conducting panel provided as a metal panel member;
• and
• a second-side heat-conducting panel provided as a metal panel member,
• wherein the first-side heat-conducting panel and the second-side heat-conducting panel have bent edge portions that are surface-bonded to each other to define a refrigerant flow space in which a refrigerant flows while undergoing phase change, and
• wherein the bent edge portion of one of the first-side heat-conducting panel and the second-side heat-conducting panel is arranged such that at least a portion thereof overlaps with the bent edge portion of the other on an outer side in a thickness direction of the refrigerant flow space so as to enable the mutual surface bonding.

A heat dissipation apparatus comprising:

• a first-side heat-conducting panel provided as a metal panel member;
• and
• a second-side heat-conducting panel provided as a metal panel member and forming, together with the first-side heat-conducting panel, a refrigerant flow space in which a refrigerant flows while undergoing phase change,
• wherein the second-side heat-conducting panel comprises a second-side thickness-forming panel bent to be inserted into the first-side heat-conducting panel, a front end of which is bonded while being concealed from the outside by the first-side heat-conducting panel.