Thermal management planes
AssigneeKelvin Thermal Technologies, Inc.
InventorsRyan J. Lewis, Ronggui Yang, Yung-Cheng Lee
Life of this patent
Estimating the term…
Abstract
Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.
Claims20
A thermal management plane comprising:
- a top casing comprising at least a polymer layer, the top casing is hermetically sealed and bondable with copper;
- a bottom casing that is hermetically sealed and bondable with copper;
- a wick disposed between the top casing and the bottom casings, wherein the wick has a non-tubular shape;
- a working fluid disposed between the top casing and the bottom casing;
- and
- a low-temperature, copper hermetic seal between an outer periphery of the top casing and the bottom casing, wherein the low-temperature is a temperature lower than 300° C.
A thermal management plane comprising:
- a top casing that is hermetically sealed and bondable with copper;
- a bottom casing that is hermetically sealed and bondable with copper, the bottom casing comprising a plurality of deformations that form a plurality of pillars;
- a wick layer disposed on the plurality of pillars, wherein the wick layer has a non-tubular shape;
- a working fluid disposed between the top casing and the bottom casing;
- and
- a copper hermetic seal that seals a periphery an outer periphery of the top casing and the bottom casing.
A thermal management plane comprising:
- a top casing that is hermetically sealed and bondable with copper, the top casing comprising at least one polymer layer;
- a bottom casing that is hermetically sealed and bondable with copper;
- a wick disposed between the top casing and the bottom casing,
- a working fluid disposed between the top casing and the bottom casing;
- and
- a copper hermetic seal that seals a periphery of the top casing and the bottom casing, wherein either or both the top casing and the bottom casing include a deformation that forms structure support.
A thermal management plane comprising:
- a top casing that is hermetically sealed and bondable with copper;
- a bottom casing that is hermetically sealed and bondable with copper;
- a wick disposed between the top casing and the bottom casings, wherein the wick has a non-tubular shape;
- a working fluid disposed between the top casing and the bottom casing;
- and
- a low-temperature, diffusion bond between an outer periphery of the top casing and the bottom casing, wherein the low-temperature is a temperature lower than 300° C.
A thermal management plane comprising:
- a top casing that is hermetically sealed and bondable with copper;
- a bottom casing that is hermetically sealed and bondable with copper;
- a wick disposed between the top casing and the bottom casing, wherein the wick has a non-tubular shape, the wick includes a plurality of arteries formed within the wick by removing portions of the wick;
- a working fluid disposed between the top casing and the bottom casing;
- and
- a hermetic seal between an outer periphery of the top casing and the bottom casing.
Dependencies are inferred from the claim text.