Copper paste, wick formation method, and heat pipe
AssigneeResonac Corporation
InventorsHideo Nakako, Toshiaki Tanaka, Dai Ishikawa, Yoshinori Ejiri, Michiko Natori
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Abstract
A copper paste for forming a wick of a heat pipe contains copper particles, thermally decomposable resin particles, a dispersion medium for dispersing the copper particles and the thermally decomposable resin particles, and a thermally decomposable resin that is soluble in the dispersion medium. A method for forming a wick of a heat pipe comprises a step of printing the copper paste and a step of sintering the copper paste. A heat pipe comprises a wick including a sintered body of the copper paste.
Claims20
A heat pipe comprising a wick including a sintered body of a copper paste,
- wherein the wick has a porosity of 58% or more by volume based on the volume of the wick, and
- wherein the copper paste, prior to being sintered, comprises:
- copper particles;
- thermally decomposable resin particles comprising a thermally decomposable resin A;
- a dispersion medium for dispersing the copper particles and the thermally decomposable resin particles;
- and
- a thermally decomposable resin B that is soluble in the dispersion medium.
A heat pipe comprising a wick including a sintered body of a copper paste,
- wherein the wick has a porosity of 58% or more by volume based on the volume of the wick, and
- wherein the copper paste, prior to being sintered, comprises:
- a dispersion medium;
- copper particles dispersed in the dispersion medium;
- thermally decomposable resin particles comprising a thermally decomposable resin A dispersed in the dispersion medium;
- and
- a thermally decomposable resin B, at least a portion of which is dissolved in the dispersion medium.
A heat pipe comprising a wick including a sintered body of a copper paste,
- wherein the wick has a porosity of 58% or more by volume based on the volume of the wick,
- wherein the copper paste, prior to being sintered, comprises:
- copper particles;
- thermally decomposable resin particles comprising a thermally decomposable resin;
- a dispersion medium for dispersing the copper particles and the thermally decomposable resin particles;
- and
- a soluble thermally decomposable resin that is at least partially soluble in the dispersion medium,
- wherein an amount of dissolution of the thermally decomposable resin particles in 100 g of the dispersion medium at 25° C. is 1 g or less, and
- wherein an amount of dissolution of the soluble thermally decomposable resin in 100 g of the dispersion medium at 25° C. is 1 g or less.
A heat pipe comprising a wick including a sintered body of a copper paste,
- wherein the wick has a porosity of 58% or more by volume based on the volume of the wick,
- wherein the copper paste, prior to being sintered, comprises:
- a dispersion medium;
- copper particles dispersed in the dispersion medium;
- thermally decomposable resin particles comprising a thermally decomposable resin dispersed in the dispersion medium, wherein an amount of dissolution of the thermally decomposable resin particles in 100 g of the dispersion medium at 25° C. is 1 g or less;
- and
- a soluble thermally decomposable resin, at least a portion of which is dissolved in the dispersion medium, wherein an amount of dissolution of the soluble thermally decomposable resin in 100 g of the dispersion medium at 25° C. is 1 g or less.
Dependencies are inferred from the claim text.