C25D 7/0635
In radial cells
Official title: {In radial cells}
C25D7/0635 (In radial cells) appears on 47 US grants and 27 published applications in this corpus.
Search patents in C25D- Granted patents
- 47
- Published applications
- 27
- Assignees
- 37
- Inventors
- 101
- Latest grant
- 17 Dec 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 4 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 5 | 0 |
| 2002 | 2 | 1 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 1 | 0 |
| 2006 | 0 | 2 |
| 2007 | 0 | 1 |
| 2008 | 0 | 1 |
| 2009 | 1 | 3 |
| 2010 | 2 | 2 |
| 2011 | 0 | 3 |
| 2012 | 3 | 1 |
| 2013 | 1 | 3 |
| 2014 | 2 | 1 |
| 2015 | 1 | 1 |
| 2016 | 0 | 3 |
| 2017 | 2 | 0 |
| 2018 | 1 | 0 |
| 2019 | 2 | 2 |
| 2020 | 0 | 0 |
| 2021 | 1 | 1 |
| 2022 | 1 | 0 |
| 2023 | 0 | 1 |
| 2024 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Surface-treated copper foil and copper clad laminate17 Dec 2024US 12,168,834 B2Chang Chun Petrochemical Co., Ltd.
- Method and apparatus for manufacturing electroplated steel sheet21 Jun 2022US 11,365,489 B2Jfe Steel Corporation
- Apparatus for fabricating electrode structure23 Feb 2021US 10,927,470 B2Electronics and Telecommunications Research Institute
- Multi-walled pipe and manufacture thereof16 Apr 2019US 10,260,660 B2TI Automotive (Heidelberg) GmbH
- Method and device for electroplating in cylindrical geometry1 Jan 2019US 10,167,565 B2Centre National de la Recherche Scientifique (CNRS)
- Surface-treated copper foil and copper clad laminate11 May 2023US 2023/0144190 A1Chang Chun Petrochemical Co., Ltd.
- Surface-treated copper foil for high-frequency circuit and method for producing the same23 Sep 2021US 2021/0298213 A1Circuit Foil Luxembourg
- Method and apparatus for manufacturing electroplated steel sheet30 May 2019US 2019/0161880 A1Jfe Steel Corporation
- Apparatus for fabricating electrode structure21 Feb 2019US 2019/0055662 A1Electronics and Telecommunications Research Institute
- Multi-walled pipe and manufacture thereof12 May 2016US 2016/0131282 A1TI Automotive (Heidelberg) GmbH
Most cited
By later US patents
- Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby34US 5,863,410 ACircuit Foil USA, Inc. · 1999
- Method for forming printed circuits14US 5,681,443 AGould Electronics Inc. · 1997
- Method and apparatus for sequentially metalized polymeric films and products made thereby14US 5,685,970 AGould Electronics Inc. · 1997
- Photoelectrochemical fabrication of electronic circuits10US 5,595,637 ARockwell International Corporation · 1997
- Thin copper on usable carrier and method of forming same10US 6,447,929 B1Gould Electronics Inc. · 2002