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US 10,927,470 B2Granted
Apparatus for fabricating electrode structure
AssigneeElectronics and Telecommunications Research Institute
InventorWoo-Seok Cheong
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Abstract
An apparatus for fabricating an electrode structure includes a high voltage unit, a plating material part facing the high voltage unit, and a transfer roll to which a negative voltage is applied. The high voltage unit includes a high voltage roll, and an insulating sheath configured to cover a surface of the high voltage roll. The high voltage roll is applied with a voltage of about 1 kV to about 100 kV, the plating material part is applied with a positive voltage, and the high voltage unit and the transfer roll rotate.
Claims18
An apparatus for fabricating an electrode structure, comprising:
- an electroplating device comprising a high voltage unit, the high voltage unit including a high voltage roll;
- a plating material part facing the high voltage unit;
- a transfer roll to which a negative voltage is applied and provided adjacent to the high voltage roll;
- a first power source coupled to the high voltage roll and configured to apply a first positive voltage from 1 kV to 100 kV to the high voltage roll;
- and
- a second power source configured to apply a second positive voltage less than 1 kV to the plating material part, the second power source including a positive voltage terminal coupled to the plating material part and a negative voltage terminal coupled to the transfer roll,
- wherein the high voltage unit further comprises:
- an insulation sheath configured to cover a surface of the high voltage roll.
5 more elements
Dependencies are inferred from the claim text.