Thin copper on usable carrier and method of forming same
AssigneeGould Electronics Inc.
InventorsJiangtao Wang, Dan Lillie, Sidney J. Clouser
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Abstract
A component for use in forming a printed circuit board comprised of a copper foil, a layer of chromium chemically deposited thereon, the layer of chromium having a thickness of less than about 0.10 μm; and a layer of electrodeposited copper on the layer of chromium, the layer of electrodeposited copper having a thickness of less than 35 μm. A nodular treatment layer is provided on the copper foil and the layer of electrodeposited copper.
Claims22
A component for use in forming a printed circuit board, comprised of:
- a copper foil that represents a useable element in a printed circuit board to be formed;
- a layer of chromium on one surface of said copper foil, said layer of chromium having a thickness of less than about 0.10 μm;
- a layer of electrodeposited copper on said layer of chromium, said layer of electrodeposited copper being a useable element in a printed circuit board to be formed;
- a nodular treatment layer on said copper foil;
- and
- a nodular treatment layer on said layer of electrically deposited copper.
A component for use in forming a printed circuit board, comprised of:
- a copper foil that represents a useable element in a printed circuit board to be formed;
- a metal-containing release layer on one surface of said copper foil, said metal-containing release layer having a thickness of up to about 0.10 μm;
- a layer of electrodeposited copper on said metal-containing release layer, said layer of electrodeposited copper being a useable element in a printed circuit board to be formed;
- a nodular treatment layer on said copper foil;
- and
- a nodular treatment layer on said layer of electrically deposited copper.
A method of forming a component for use in manufacturing printed circuits, comprising the steps of:
- (a) cleaning one surface of a copper foil by exposing a surface of a copper foil to an acid solution to remove oxide film from said surface;
- (b) rinsing said surface to remove residual acid solution;
- (c) electrolytically depositing a layer of chromium on said surface, said layer of chromium having a thickness less than about 0.10 μm;
- (d) cleaning and drying said layer of chromium;
- (e) electrodepositing of a layer of copper on said chromium layers;
- and
- (f) applying a nodular treatment to said copper foil and to said layer of copper.
A method of forming printed circuits, comprising the steps of:
- (a) applying a metal-containing release layer of material that is less than about 0.10 μm onto a clean surface of a copper foil;
- (b) electrodepositing a layer of copper onto said metal-containing release layer;
- (c) applying a nodular treatment to said copper foil and to said layer of copper;
- (d) bonding said copper foil to a first prepreg layer and said layer of copper to a second prepreg layer;
- and
- (e) separating said prepreg layers such that said copper foil separates from said layer of copper along said metal-containing release layer.
Dependencies are inferred from the claim text.