Method and apparatus for sequentially metalized polymeric films and products made thereby

A method for electroplating a metal onto a non-metallic electrically insulating substrate, comprising the steps of:

• a) depositing a thin flash of metal onto one side of a non-metallic electrically-insulating substrate;
• b) moving said substrate along a path including a non-conductive surface through an electrolytic solution having a plurality of adjacent anodes which are positioned adjacent to and facing said surface, said anodes defining a thin uniform gap with said surface, said substrate moving along said surface with said metal side of said substrate facing said anodes and exiting said electrolytic solution after passing said anodes;
• c) passing said metal side of said substrate over an electrically conductive cathode located outside said electrolytic solution;
• and
• d) causing groups of one or more of said adjacent anodes to have a different level of current density as said substrate passes through said electrolytic solution to continuously electrodeposit and build up metal on said metal side of said moving substrate, the level of current density of a specific group of anodes being greater than a group of anodes which precedes it along said path and being based upon current carrying capacity of the flash metal or of the built-up metal existing on said substrate between said specific group of anodes and said cathode.