Method and device for electroplating in cylindrical geometry
AssigneesElectricite de France, Centre National de la Recherche Scientifique (CNRS)
InventorsGregory Savidand, Nicolas Loones, Daniel Lincot, Elisabeth Chassaing
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Abstract
A method and device for electrodeposition in cylindrical geometry. A method for electrochemically depositing a thin layer on a flexible substrate, comprising: providing, in an electrolysis bath, a first closed cylinder in a second hollow cylinder, applying the flexible substrate to one of the surfaces chosen from the outer surface of the first cylinder and the inner surface of the second, the flexible substrate forming a first electrode, providing, in the electrolysis bath, a second electrode, and applying a potential difference between the first electrode and the second electrode in order to electrodeposit the thin layer on the flexible substrate.
Claims9
A method for plating a thin layer on a flexible substrate, by electrochemistry, comprising:
- providing, in an electrolytic bath, a first closed cylinder inside a second hollow cylinder, the electrolytic bath being filled with an electrolytic solution, the electrolytic solution being comprised in a volume delimited between the first cylinder and the second cylinder,
- applying the flexible substrate on one surface among an outer surface of the first cylinder and an inner surface of the second cylinder, said flexible substrate forming a first electrode,
- providing, in said electrolytic bath, at least one second electrode, and
- applying a potential difference between the first electrode and the second electrode to electroplate the thin layer on the flexible substrate.
Dependencies are inferred from the claim text.