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US 12,168,834 B2Granted
Surface-treated copper foil and copper clad laminate
AssigneeChang Chun Petrochemical Co., Ltd.
InventorsJian-Ming Huang, Yao-Sheng Lai, Jui-Chang Chou
Life of this patent
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Abstract
A surface-treated copper foil includes a bulk copper foil and a first surface treatment layer. The first surface treatment layer is disposed on a first surface of the bulk copper foil and includes a roughening layer, where the outermost surface of the first surface treatment layer is a treating surface of the surface-treated copper foil. The material volume (Vm) of the treating surface is 0.06 to 1.45 μm3/μm2, and the five-point peak height (S5p) of the treating surface is 0.15 to 2.00 μm.
Claims9
A surface-treated copper foil, comprising:
- a bulk copper foil, comprising a first surface;
- and
- a first surface treatment layer, disposed on the first surface and comprising a roughening layer, wherein an outermost surface of the first surface treatment layer is a treating surface of the surface-treated copper foil, the material volume (Vm) of the treating surface is in a range of 0.06 to 1.45 μm3/μm2, and the five-point peak height (S5p) of the treating surface is in a range of 0.15 to 2.00 μm.
Dependencies are inferred from the claim text.