C25D 5/505
Of electroplated tin coatings
Official title: {of electroplated tin coatings, e.g. by melting}
C25D5/505 (Of electroplated tin coatings) appears on 186 US grants and 243 published applications in this corpus.
Search patents in C25D- Granted patents
- 186
- Published applications
- 243
- Assignees
- 105
- Inventors
- 481
- Latest grant
- 6 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 4 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 0 |
| 2002 | 2 | 1 |
| 2003 | 1 | 0 |
| 2004 | 2 | 2 |
| 2005 | 0 | 1 |
| 2006 | 1 | 3 |
| 2007 | 0 | 2 |
| 2008 | 1 | 3 |
| 2009 | 2 | 1 |
| 2010 | 1 | 9 |
| 2011 | 2 | 7 |
| 2012 | 3 | 5 |
| 2013 | 2 | 19 |
| 2014 | 8 | 22 |
| 2015 | 8 | 27 |
| 2016 | 13 | 19 |
| 2017 | 13 | 29 |
| 2018 | 17 | 15 |
| 2019 | 24 | 15 |
| 2020 | 17 | 17 |
| 2021 | 12 | 9 |
| 2022 | 8 | 16 |
| 2023 | 8 | 11 |
| 2024 | 8 | 2 |
| 2025 | 4 | 5 |
| 2026 | 1 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Structure containing Sn layer or Sn alloy layer6 Jan 2026US 12,519,071 B2Ishihara Chemical Co., Ltd.
- Method for manufacturing laminated tinplate, a laminated tinplate produced thereby and use thereof9 Dec 2025US 12,492,483 B2Tata Steel Nederland Technology B.V.
- Method for passivating a tinplate strip and apparatus for producing said passivated tinplate strip15 Jul 2025US 12,359,337 B2Tata Steel Ijmuiden B.V.
- Low melting-point bonding member, method for producing same, semiconductor electronic circuit, and method for mounting said semiconductor electronic circuit29 Apr 2025US 12,285,823 B2Shinryo Corporation
- Cu—Ni—Si based copper alloy plate, Cu—Ni—Si based copper alloy plate with plating film, and methods of producing the same1 Apr 2025US 12,264,407 B2Mitsubishi Materials Corporation
- Surface-treated steel sheet and method of producing same28 May 2026US 2026/0146333 A1Jfe Steel Corporation
- Rhenium-cobalt alloy composition and process for effective metal electrodeposition in 3d-integration28 May 2026US 2026/0146356 A1
- Conductive material, and method for manufacturing same5 Mar 2026US 2026/0066149 A1Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
- Tin-plated steel sheet and can18 Dec 2025US 2025/0382114 A1Nippon Steel Corporation
- Manufacturing method for tinplate8 May 2025US 2025/0144686 A1Institute of Research of Iron and Steel, Jiangsu Province/Sha-Steel, Co. Ltd (Cn)
Most cited
By later US patents
- Lead free bump and method of forming the same28US 7,012,333 B2Ebara Corporation · 2006
- Hard coated copper alloys, process for production thereof and connector terminals made therefrom24US 5,849,424 ADowa Mining Co., Ltd. · 1998
- Surface treatment process for copper foil22US 4,082,591 AMitsui-Anaconda Electro Copper Sheet Co., Ltd. · 1978
- Hard coated copper alloys16US 6,040,067 ADowa Mining Co., Ltd. · 2000
- Metallic material14US 6,613,451 B1Nippon Mining & Metals Co., Ltd. · 2003