Rhenium-cobalt alloy composition and process for effective metal electrodeposition in 3d-integration
OwnerStephen Lombardo, Wenbo Shao +2inventors
InventorsStephen Lombardo, Wenbo Shao, Eric Yakobson, Elie Najjar
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Abstract
A method of creating one or more metal interconnects in an electronic device, wherein the electronic device comprises one or more features within which the one or more metal interconnects are created, the method comprising the steps of (a) depositing a copper layer on the one or more features; (b) depositing a rhenium-cobalt alloy layer on the copper layer; and (c) depositing a tin or tin alloy layer on the rhenium-cobalt alloy layer; wherein the rhenium-cobalt alloy layer comprises greater than 50 wt. % rhenium.
Claims17
A method of creating one or more metal interconnects in an electronic device, wherein the electronic device comprises one or more features within which the one or more metal interconnects are created, the method comprising the steps of:
- a. depositing a copper layer on the one or more features;
- b. depositing a rhenium-cobalt alloy layer on the copper layer;
- and
- c. depositing a tin or tin alloy layer on the rhenium-cobalt alloy layer;
- wherein the rhenium-cobalt alloy layer comprises greater than 50 wt. % rhenium.
An electronic device comprising one or more electrical interconnections, wherein the one or more electrical interconnections comprise one or features filled with a conducting material, wherein the conducting material comprises:
- a. a copper layer;
- b. a rhenium-cobalt alloy barrier layer deposited on the copper layer, wherein the rhenium-cobalt alloy barrier layer comprises greater than 50 wt. % rhenium;
- and
- c. a tin containing layer deposited on the rhenium cobalt barrier layer.
Dependencies are inferred from the claim text.