Lead free bump and method of forming the same
AssigneeEbara Corporation
InventorsMasashi Shimoyama, Hiroshi Yokota, Rei Kiumi, Fumio Kuriyama, Nobutoshi Saito
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Abstract
The present invention relates to a lead-free bump with suppressed formation of voids, obtained by reflowing a plated film of Sn—Ag solder alloy having an adjusted Ag content, and a method of forming the lead-free bump. The lead-free bump of the present invention is obtained by forming an Sn—Ag alloy film having a lower Ag content than that of an Sn—Ag eutectic composition by plating and reflowing the plated alloy film.
Claims5
A lead-free bump obtained by forming an Sn—Ag alloy film having a lower Ag content than that of an Sn—Ag eutectic composition by plating and reflowing the plated alloy film.
Dependencies are inferred from the claim text.