Low melting-point bonding member, method for producing same, semiconductor electronic circuit, and method for mounting said semiconductor electronic circuit

A low melting-point bonding member for mounting a semiconductor electronic circuit, comprising

• a micro member having a size of 1 mm or less and having a plating layer coating a surface layer of any core material selected from the group consisting of a micro metal ball, a micro resin ball having a coating layer of a conductive metal, a micro resin ball having a coating layer of a solder alloy, and a micro pin member, wherein
• the plating layer is formed of a low melting-point alloy, wherein the low melting-point alloy is made up of Bi, In, Sn, and inevitably-contained impurities, and
• the low melting-point alloy contains Bi:
• 63 mass % or more and 72 mass % or less, In:
• 26 mass % or more and 36.9 mass % or less, and Sn:
• 0.1 mass % or more and 2 mass % or less when a total amount of Bi, In, and Sn in the low melting-point alloy is 100 mass % and has a melting point of 106 to 111° C.

A method for producing a low melting-point bonding member, comprising

• a plating step of performing a plating process at least including Bi plating and In plating and forming, on an object to be plated, a plating layer made up of Bi, In, and inevitably-contained impurities or a plating layer made of Bi, In, Sn, and inevitably-contained impurities, wherein
• the plating layer contains Bi:
• 46 mass % or more and 72 mass % or less, In:
• 26 mass % or more and 54 mass % or less, and Sn:
• 2 mass % or less when a total amount of Bi, In, and Sn is 100 mass %, and
• the plating step is a plating step (A) or a plating step (B) described below:
• Plating step (A):
• a step in which the plating process includes Bi plating and In plating and in which the In plating is performed after the Bi plating is performed,
• Plating step (B):
• a step in which the plating process includes Bi plating, In plating, and Sn plating and in which the plating process to be first performed on the object to be plated is Sn plating or Bi plating, and the In plating is performed after the Sn plating and the Bi plating are performed.