Conductive material, and method for manufacturing same
AssigneeKabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
InventorYutaro UEDA
Life of this patent
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Abstract
A conductive material includes a base material composed of copper or a copper alloy; an underlayer being one or more layers composed of one or more selected from the group consisting of Ni, Co and Fe; a Cu—Sn alloy layer; and a Sn layer in this order. A part of the Cu—Sn alloy layer is exposed on a Sn layer-side surface of the conductive material, and an arithmetic mean height evaluated with a cut-off value of 25 μm is 0.03 μm or more in a 250 μm square region containing 50 area % or more of the Sn layer in the Sn layer-side surface of the conductive material.
Claims8
A conductive material comprising:
- a base material composed of copper or a copper alloy;
- an underlayer being one or more layers composed of one or more selected from the group consisting of Ni, Co and Fe;
- a Cu—Sn alloy layer;
- and a Sn layer in this order,
- wherein a part of the Cu—Sn alloy layer is exposed on a Sn layer-side surface of the conductive material, and
- an arithmetic mean height evaluated with a cut-off value of 25 μm is 0.03 μm or more in a 250 μm square region containing 50 area % or more of the Sn layer in the Sn layer-side surface of the conductive material.
A method for manufacturing a conductive material, the method comprising:
- forming an underlayer being one or more layers composed of one or more selected from the group consisting of Ni, Co, and Fe on a base material composed of copper or a copper alloy;
- forming a Cu layer and a Sn layer in this order on the underlayer, and then performing a reflow treatment to obtain a Cu—Sn alloy layer;
- forming a non-glossy Sn plating layer having a plating thickness of 0.025 to 0.25 μm after the reflow treatment;
- and
- exposing a part of the Cu—Sn alloy layer on a surface of the non-glossy Sn plating layer.
Dependencies are inferred from the claim text.