Metallic material

A metallic material comprising an intermediate layer on a base metal consisting of Cu or Cu alloy, and a surface layer consisting of Sn or Sn alloy plated on said intermediate layer wherein said intermediate layer of alloy plating consists of Ni alloy or Cu alloy and said intermediate layer made of said alloy consists of P in an amount of 0.05 to 20% by weight, B in an amount of 0.05 to 20% by weight, and the balance consisting of Ni and unavoidable impurities.

A metallic material comprising an intermediate layer on a base metal consisting of Cu or Cu alloy, and a surface layer consisting of Sn or Sn alloy plated on said intermediate layer wherein said intermediate layer of alloy plating is made of an electroplated Ni alloy containing P and/or B in a total amount of 0.05 to 20% by weight, and P and/or B content in said surface layer is increased in a total amount of 0.01 to 1% by weight by carrying out a reflow treatment after forming said surface layer.

A metallic material comprising an intermediate layer on a base metal consisting of Cu or Cu alloy, and a surface layer consisting of Sn or Sn alloy plated on said intermediate layer wherein said intermediate layer of alloy plating is made of an electroplated Ni alloy containing P and/or B in a total amount of 0.05 to 20% by weight, and P and/or B contained in said intermediate layer is diffused toward a surface of said Sn or Sn alloy plating layer by carrying out a reflow treatment and/or a heating treatment after forming said surface layer.

A metallic material comprising an intermediate layer on a base metal consisting of Cu or Cu alloy, and a surface layer consisting of Sn or Sn alloy plated on said intermediate layer wherein said intermediate layer of alloy plating consists of Ni alloy or Cu alloy including at least one of P in an amount of 0.05 to 20% by weight and B in an amount of 0.05% to 20% by weight and wherein said Sn or Sn alloy plating layer contains C in an amount of 0.05 to 0.5% by weight.

A metallic material comprising an intermediate layer on a base metal consisting of Cu or Cu alloy and a surface layer consisting of Sn or Sn alloy plated on said intermediate layer wherein said intermediate layer of alloy plating consists of Ni alloy or Cu alloy including at least one of P in an amount of 0.05% to 20% by weight and B in an amount of 0.05% to 20% by weight and wherein said surface layer is a plating film in which an electroplated Sn or Sn alloy is subjected to a reflow treatment.

A metallic material comprising an intermediate layer on a base metal consisting of Cu or Cu alloy, and a surface layer consisting of Sn or Sn alloy plated on said intermediate layer wherein said intermediate layer of alloy plating consists of Ni alloy or Cu alloy including at least one of P in an amount of 0.05 to 20% by weight and B in an amount of 0.05% to 20% by weight and wherein an aging treatment is carried out after said plating or after reflow treatment.

A metallic material comprising an intermediate layer on a base metal consisting of Cu or Cu alloy, and a surface layer consisting of Sn or Sn alloy plated on said intermediate layer wherein said intermediate layer of alloy plating consists of Ni alloy or Cu alloy and is made of an alloy containing P in an amount of 0.05 to 15% by weight, and the balance consisting of Cu and unavoidable impurities.

A metallic material comprising an intermediate layer on a base metal consisting of Cu or Cu alloy, and a surface layer consisting of Sn or Sn alloy plated on said intermediate layer of alloy plating consists of Ni alloy or Cu alloy and wherein said intermediate layer is made of an alloy consisting of P in an amount of 0.05 to 15% by weight, at least one of Sn, Ni, and Zn, in a total amount of 10 to 60% by weight, and the balance consisting of Cu and unavoidable impurities.

A metallic material comprising an intermediate layer on a base metal consisting of Cu or Cu alloy, and a surface layer consisting of Sn or Sn alloy plated on said intermediate layer wherein said intermediate layer of alloy plating consists of Ni alloy or Cu alloy and wherein said intermediate layer made of said alloy consists of P in an amount of 0.05 to 15% by weight, B in an amount of 0.05 to 15% by weight, and the balance consisting of Cu and unavoidable impurities.

A metallic material comprising an intermediate layer on a base metal consisting of Cu or Cu alloy, and a surface layer consisting of Sn or Sn alloy plated on said intermediate layer of alloy plating wherein said intermediate layer consists of Ni alloy or Cu alloy and wherein said intermediate layer made of said alloy consists of P in an amount of 0.05 to 15% by weight, B in an amount of 0.05 to 15% by weight, at least one of Sn, Ni, and Zn, in a total amount of 10 to 60% by weight, and the balance consisting of Cu and unavoidable impurities.

A terminal and a connector having superior heat resistance, aging resistance, and insertion and withdrawal properties, wherein a contact is made of metallic material comprising an intermediate layer on a base metal consisting of Cu or Cu alloy, and a surface layer consisting of Sn or Sn alloy plated one said intermediate layer, wherein said intermediate layer of alloy plating consists of Ni alloy or Cu alloy including at least on of P in an amount of 0.05% to 20% by weight and B in an amount of 0.05% to 20% by weight.