C25D 3/62
Containing more than 50% by weight of gold
Official title: containing more than 50% by weight of gold
C25D3/62 (Containing more than 50% by weight of gold) appears on 109 US grants and 88 published applications in this corpus.
Search patents in C25D- Granted patents
- 109
- Published applications
- 88
- Assignees
- 78
- Inventors
- 288
- Latest grant
- 24 Dec 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 6 | 0 |
| 1978 | 5 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 3 | 0 |
| 1982 | 4 | 0 |
| 1983 | 5 | 0 |
| 1984 | 6 | 0 |
| 1985 | 1 | 0 |
| 1986 | 4 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 0 | 1 |
| 2003 | 3 | 1 |
| 2004 | 3 | 5 |
| 2005 | 0 | 1 |
| 2006 | 0 | 3 |
| 2007 | 1 | 1 |
| 2008 | 2 | 2 |
| 2009 | 2 | 3 |
| 2010 | 1 | 5 |
| 2011 | 1 | 5 |
| 2012 | 4 | 8 |
| 2013 | 2 | 2 |
| 2014 | 1 | 7 |
| 2015 | 3 | 8 |
| 2016 | 3 | 6 |
| 2017 | 6 | 7 |
| 2018 | 3 | 4 |
| 2019 | 3 | 3 |
| 2020 | 5 | 6 |
| 2021 | 2 | 3 |
| 2022 | 5 | 1 |
| 2023 | 0 | 1 |
| 2024 | 3 | 2 |
| 2025 | 0 | 3 |
By publication year. Applications have been published since 2001.
Recent patents
- Gold electroplating solution24 Dec 2024US 12,173,424 B2Eeja Ltd.
- Coated wire10 Sep 2024US 12,084,784 B2Heraeus Materials Singapore Pte. Ltd.
- Method for depositing a decorative and/or functional metal layer on a surface of an article made of an electrically non-conductive ceramic material9 Apr 2024US 11,952,667 B2The Swatch Group Research and Development Ltd
- Metal or metal alloy deposition composition and plating compound29 Nov 2022US 11,512,405 B2Atotech Deutschland GmbH
- Electrolytic treatment process for coating stainless steel objects16 Aug 2022US 11,414,772 B2
- Part with 3d decoration and its manufacturing method11 Dec 2025US 2025/0377635 A1Comadur SA
- Compositions and methods using hexagonal boron nitride13 Nov 2025US 2025/0347021 A1
- Gold electroplating solution and its use for electrodepositing gold with an aged appearance19 Jun 2025US 2025/0198037 A1
- High-speed pure gold electroforming/electroplating bath15 Aug 2024US 2024/0271306 A1P & S, Galvasols
- Gold electroplating solution28 Mar 2024US 2024/0102193 A1Eeja Ltd.
Most cited
By later US patents
- Biocompatible electroplated interconnection bonding method and electronics package suitable for implantation21US 7,846,285 B2Second Sight Medical Products, Inc. · 2010
- Plating compositions and processes20US 5,169,514 AEnthone-OMI, Inc. · 1992
- Plated materials and contacts for connectors made by using the same20US 6,627,329 B1Japan Aviation Electronics Industry, Limited · 2003
- Graded metal hardware component for an electrochemical cell19US 5,942,350 AUnited Technologies Corporation · 1999
- Electroplated gold-copper-silver alloys17US 5,256,275 ALeaRonal, Inc. · 1993