High-speed pure gold electroforming/electroplating bath

Abstract

“HIGH SPEED PURE GOLD ELECTROFORMING/ELECTROPLATING BATH” consisting of a. gold potassium sulphite and sodium gold sulphite of 1-40 g/l ; b. lithium sodium potassium rubidium or cesium salts of sulphurous acid of 2-100 g/l; c. alkali salts of phosphoric acid of 2-100 g/l; d. phosphonic acids in the form of 1-hydroxyl ethane-1, 1, diphosphonic acid, methylene phosphonic acid, ethylene diamine tetra methylene phosphonic acid of 2-50 g/l; e. bismuth as citrate, tartrate, oxalate, phosphonate or NTA complex of 5-1000 mg/l; and f. some amount of pyrophosphate, poly phosphates and other supporting electrolytes and wetting agents. The high speed pure gold electroforming/electroplating bath allows formation of wire structure in IC chips and/or dental/jewellery application with fine grain, high density, high uniformity, ability to withstand electrical stress and different hardness without using cyanide.

Dependencies are inferred from the claim text.