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US 6,627,329 B1Granted
Plated materials and contacts for connectors made by using the same
AssigneeJapan Aviation Electronics Industry, Limited
InventorTadashi Shintani
Life of this patent
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Abstract
A plated material having a substrate, and a plating formed on the substrate, or on an undercoating formed on the substrate further has a layer formed on the plating from an organic compound capable of combining chemically with a component of the plating, and a lubricating layer formed on the layer of an organic compound. The lubricating layer is substantially a fluid film of a high molecular compound.
Claims27
A contact for a connector comprising:
- a base metal;
- a plating formed on a surface of the base metal;
- a bonding layer of a corrosion resistant organic substance formed on the plating and bonded thereto for inhibiting corrosion of the base metal;
- and
- a lubricating layer formed on the bonding layer;
- the organic substance being a corrosion resistant organic compound having a thiol (—SH) group and being capable of combining chemically with a component of the plating, the lubricating layer consisting essentially of a fluid film of a high molecular mass compound.
3 more elements
A contact for a connector comprising:
- a base material;
- an undercoating formed on the base material;
- a plating formed on a surface of the undercoating;
- a bonding layer of a corrosion resistant organic substance formed on and bonded to the plating for inhibiting corrosion of the undercoating;
- and
- a lubricating layer formed on the bonding layer, the organic substance being an organic compound having a thiol (—SH) group in which a combination must be able to occur with a component as part of the plating, the lubricating layer consisting essentially of a fluid film of a high molecular mass.
3 more elements
A contact for a connector comprising:
- a base material;
- an undercoating formed on the base material;
- a plating formed on a surface of the undercoating;
- a bonding layer of an organic substance formed on the plating and bonded thereon;
- and
- a lubricating layer formed on the bonding layer, the organic substance being an organic compound having a thiol (—SH) group in which a combination must be able to occur with a component as part of the plating, the lubricating layer consisting essentially of a fluid film of a high molecular mass;
- wherein said base material is an electrical conductor, said electric conductor is a metallic material;
- and said metallic material is selected from a group consisting of at least one of copper, a copper alloy, iron, and stainless steel.
5 more elements
A plated material comprising:
- a base material;
- an undercoating formed on a surface of the base material;
- a plating formed on a surface of the undercoating;
- a bonding layer of an organic substance formed on the plating and bonded thereon for inhibiting corrosion of the undercoating;
- and
- a lubricating layer formed on the bonding layer, the organic substance being an organic compound having a thiol (—SH) group and being capable of combining chemically with a component of the plating, the lubricating layer consisting essentially of a fluid film of a high molecular mass compound, which compound is selected from the group consisting of a fatty acid, an ester, an olefin or an aromatic.
3 more elements
Dependencies are inferred from the claim text.