Electroplated gold-copper-silver alloys

A solution for electroplating a gold-copper-silver alloy consisting essentially of:

• a soluble gold compound present as a gold cyanide complex in the solution and being present at a concentration of between about 1-12 gm/l as gold metal;
• a soluble copper compound present as a copper cyanide complex in the solution and being present at a concentration of between about 5-50 gm/l as copper metal;
• a soluble silver compound present as a silver cyanide complex in the solution and being present at a concentration of between about 0.1-1 gm/l as silver metal;
• a solution soluble divalent sulfur compound, said divalent sulfur compound present at a concentration of between about 0.075-1 gm/l in said solution for brightening alloys deposited by said solution;
• and
• at least one surface active agent present in said solution,
• said solution having a pH of between about 8 and 11.

A process for electroplating gold-copper-silver alloys which comprises:

• formulating a solution having a pH of between 8 and 11 and comprising a soluble gold compound present as a gold cyanide complex, a soluble copper compound present as a copper cyanide complex, a soluble silver compound present as a silver cyanide complex in an amount of at least about .1 gm/l, and a solution soluble divalent sulfur compound in an amount of at least about 0.075 gm/l;
• immersing a substrate at least partially into the solution;
• and
• electroplating a gold-copper-silver alloy upon the substrate at a current density of between about 1 to 15 ASF and at a temperature of between about 100.degree. and 170.degree. F. for a sufficient time with a current manipulating step which includes switching current on and off at predetermined intervals to deposit a sufficient thickness of a desired gold alloy.