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US 2025/0198037 A1Published application
Gold electroplating solution and its use for electrodepositing gold with an aged appearance
OwnerJonathan SCHOENLEBER, Jean-Yves HIHN +2inventors
InventorsJonathan SCHOENLEBER, Jean-Yves HIHN, Marie-Pierre GIGANDET, Jérôme HUSSON
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Abstract
The invention relates to a gold electroplating solution comprising gold in the form of a complex with a compound of formula (I) or a salt thereof: R1S—Ar—CO2H (I) Wherein: R1 is H, a C1-C6 alkyl group or —S—Ar—CO2H, Ar is, at each occurrence, independently, selected from a C6-C10 arylene or a 5 to 10 membered heteroarylene group, notably a phenylene, a pyridinylene, a furanylene, a pyrrolylene, or a thienylene group.
Claims16
A gold electroplating solution comprising gold in the form of a complex with a compound of formula (I) or a salt thereof:
- R1S—Ar—CO2H (I)
- wherein:
- R1 is H, a C1-C6 alkyl group or —S—Ar—CO2H, Ar is, at each occurrence, independently, selected from a C6-C10 arylene or a 5 to 10 membered heteroarylene group, notably a phenylene, a pyridinylene, a furanylene, a pyrrolylene, or a thienylene group, and wherein the concentration of the compound of formula (I) is from 1 to 10 g/L.
Dependencies are inferred from the claim text.