C25D 3/58
Containing more than 50% by weight of copper
Official title: containing more than 50% by weight of copper
C25D3/58 (Containing more than 50% by weight of copper) appears on 203 US grants and 242 published applications in this corpus.
Search patents in C25D- Granted patents
- 203
- Published applications
- 242
- Assignees
- 149
- Inventors
- 540
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 2 |
| 2002 | 6 | 5 |
| 2003 | 6 | 2 |
| 2004 | 2 | 7 |
| 2005 | 3 | 8 |
| 2006 | 2 | 8 |
| 2007 | 2 | 4 |
| 2008 | 1 | 3 |
| 2009 | 4 | 5 |
| 2010 | 2 | 9 |
| 2011 | 1 | 9 |
| 2012 | 5 | 11 |
| 2013 | 3 | 16 |
| 2014 | 6 | 12 |
| 2015 | 9 | 19 |
| 2016 | 15 | 24 |
| 2017 | 25 | 19 |
| 2018 | 7 | 19 |
| 2019 | 15 | 8 |
| 2020 | 14 | 16 |
| 2021 | 10 | 7 |
| 2022 | 9 | 8 |
| 2023 | 2 | 6 |
| 2024 | 10 | 9 |
| 2025 | 5 | 5 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Ultrathin copper foil, a method for manufacturing the same, and an article made therefrom25 Aug 2026US 12,716,144 B2Dupont Electronics, Inc.
- Copper alloy film with high strength and high conductivity16 Jun 2026US 12,655,500 B2Apple Inc.
- Copper electroplating baths containing reaction products of amines, polyacrylamides and bisepoxoides26 Aug 2025US 12,398,479 B2Dow Global Technologies LLC
- Additive composition for plating solution12 Aug 2025US 12,385,154 B2
- PCB terminal, connector, wiring harness with connector and board unit20 May 2025US 12,308,538 B2Autonetworks Technologies, Ltd.
- Surface-treated copper foil having pillar nodule structure, and copper clad laminate and printed wiring board comprising same5 Mar 2026US 2026/0068035 A1Lotte Energy Materials Corporation
- Formation of alloys on 2d and 3d electrically conducting surfaces utilizing galvanic displacement27 Nov 2025US 2025/0361622 A1Colorado State University Research Foundation
- Electrodeposition of nanotwinned cu alloys30 Oct 2025US 2025/0333871 A1Apple Inc.
- Chemically anchored mold compounds in semiconductor packages24 Jul 2025US 2025/0236955 A1
- Leveling agent, composition, and application thereof3 Jul 2025US 2025/0215598 A1Fudan University
Most cited
By later US patents
- Copper alloy electroplating bath for microelectronic applications264US 6,319,387 B1Semitool, Inc. · 2001
- Method for the production of alloys possessing high elastic modulus and improved magnetic properties by electrodeposition51US 4,652,348 ATechnion Research & Development Foundation Limited · 1987
- Copper foil for printed wiring board41US 5,712,047 ANippon Denkai, Ltd. · 1998
- Metallization structures for microelectronic applications and process for forming the structures38US 6,368,966 B1Semitool, Inc. · 2002
- Method of making a plain bearing sliding layer35US 5,156,729 AMetal Leve S.A. · 1992