Additive composition for plating solution
OwnerMi Yun Kim, Seon Young Park +1inventors
InventorsMi Yun Kim, Seon Young Park, Hye Soo Park
Life of this patent
Estimating the term…
Abstract
An additive composition for plating solution is to enhance wear resistance and gloss properties of plating. The additive composition may include at least one material selected from the group consisting of tungsten, phosphorus and indium. When the additive composition for a plating solution is added to an existing IR plating solution, it can be used for a long period of time, and the gloss becomes excellent after plating, and the gloss-lasting time is prolonged.
Claims8
A composition for an imitation rhodium plating the composition comprising:
- a solution comprising copper, tin and zinc;
- and
- an additive comprising tungsten and indium;
- wherein the tungsten is sodium tungsten, and the indium is indium sulfate.
A composition for an imitation rhodium plating, the composition comprising:
- a solution comprising copper, tin and zinc;
- and
- an additive comprising tungsten, phosphorus and indium,
- wherein the tungsten is sodium tungsten, the phosphorus is sodium hypophosphite monohydrate or potassium pyrophosphate, and the indium is indium sulfate.
Dependencies are inferred from the claim text.