C25D 3/38
Of copper
Official title: of copper
C25D3/38 (Of copper) appears on 1,278 US grants and 1,834 published applications in this corpus.
Search patents in C25D- Granted patents
- 1,278
- Published applications
- 1,834
- Assignees
- 640
- Inventors
- 3,354
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 7 | 0 |
| 1978 | 2 | 0 |
| 1979 | 3 | 0 |
| 1980 | 3 | 0 |
| 1981 | 1 | 0 |
| 1982 | 4 | 0 |
| 1983 | 4 | 0 |
| 1984 | 9 | 0 |
| 1985 | 5 | 0 |
| 1986 | 1 | 0 |
| 1987 | 5 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 7 | 0 |
| 1991 | 7 | 0 |
| 1992 | 5 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 7 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 7 | 0 |
| 1999 | 6 | 0 |
| 2000 | 6 | 0 |
| 2001 | 10 | 6 |
| 2002 | 13 | 30 |
| 2003 | 25 | 32 |
| 2004 | 18 | 50 |
| 2005 | 16 | 49 |
| 2006 | 17 | 51 |
| 2007 | 14 | 35 |
| 2008 | 23 | 25 |
| 2009 | 8 | 33 |
| 2010 | 26 | 47 |
| 2011 | 19 | 30 |
| 2012 | 24 | 62 |
| 2013 | 26 | 69 |
| 2014 | 34 | 62 |
| 2015 | 35 | 94 |
| 2016 | 49 | 134 |
| 2017 | 90 | 103 |
| 2018 | 70 | 119 |
| 2019 | 101 | 126 |
| 2020 | 107 | 113 |
| 2021 | 88 | 108 |
| 2022 | 83 | 116 |
| 2023 | 76 | 111 |
| 2024 | 91 | 104 |
| 2025 | 64 | 79 |
| 2026 | 40 | 46 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Double layered electrolytic copper foil and manufacturing method thereof6 Oct 2026US 12,753,524 B2Volta Energy Solutions S.A.R.L.
- Surface-treated copper foil, and copper-clad laminate and printed wiring board including the surface-treated copper foil8 Sep 2026US 12,729,451 B2Fukuda Metal Foil & Powder Co., Ltd.
- Ultrathin copper foil, a method for manufacturing the same, and an article made therefrom25 Aug 2026US 12,716,144 B2Dupont Electronics, Inc.
- Electroplating systems and methods with increased metal ion concentrations11 Aug 2026US 12,703,926 B2APPLIED Materials.Inc.
- Abrasion resistant coated tube14 Jul 2026US 12,680,629 B2Cooper-Standard Automotive Inc.
- Electroplated carbon fiber having electroplated layer and method for producing thereof1 Oct 2026US 2026/0297787 A1Fuji Design Co., Ltd.
- Conductivity enhanced metal-nanocarbon hybrids and method for preparation1 Oct 2026US 2026/0297790 A1
- Electrodeposited copper foil and applications thereof24 Sep 2026US 2026/0286560 A1Dupont Electronics, Inc.
- Differential contrast plating for advanced packaging applications3 Sep 2026US 2026/0258571 A1Lam Research Corporation
- Plating solution27 Aug 2026US 2026/0250872 A1Jcu Corporation
Most cited
By later US patents
- Method for electrochemically depositing metal on a semiconductor workpiece328US 6,565,729 B2Semitool, Inc. · 2003
- Electro deposition chemistry321US 6,113,771 AAPPLIED Materials.Inc. · 2000
- Pulse electroplating copper or copper alloys222US 5,972,192 AAdvanced Micro Devices, Inc. · 1999
- Electro-chemical deposition system and method of electroplating on substrates211US 6,261,433 B1APPLIED Materials.Inc. · 2001
- Method to improve planarity of electroplated copper199US 7,064,068 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2006