Electrodeposited copper foil and applications thereof
AssigneeDupont Electronics, Inc.
InventorsYA-MEI LIN, SHIH-CHING LIN, CHI YEN
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Abstract
The present disclosure provides an electrodeposited copper foil having a smooth matte side. The said matte side has a maximum height of profile Rz of 150 nm or less; an arithmetic mean height Sa of 100 nm or less; a root mean square height Sq of 100 nm or less; and a developed interfacial area ratio Sdr of 2% or higher; wherein the Rz, Sa, Sq and Sdr are measured according to ISO 4287-1997 using an atomic force microscope. The present disclosure also provides a method for manufacturing an electrodeposited copper foil and an article comprising an electrodeposited copper foil.
Claims10
An electrodeposited copper foil, which has a matte side having:
- a maximum height of profile Rz of 150 nm or less;
- an arithmetic mean height Sa of 100 nm or less;
- a root mean square height Sq of 100 nm or less;
- and
- a developed interfacial area ratio Sdr of 2% or higher;
- wherein the Rz, Sa, Sq and Sdr are measured according to ISO 4287-1997 using an atomic force microscope.
Dependencies are inferred from the claim text.