Electro-chemical deposition system and method of electroplating on substrates

An apparatus for electrochemical deposition of a metal onto a substrate having a substrate plating surface, comprising:

• a) a substrate holder adapted to hold the substrate in a position wherein the substrate plating surface is exposed to an electrolyte in an electrolyte container;
• wherein the substrate holder comprises:
• i) a vacuum chuck having a substrate support surface;
• and
• ii) a gas bladder disposed around the substrate support surface, the gas bladder adapted to contact a peripheral portion of the substrate;
• b) a cathode electrically contacting the substrate plating surface;
• c) an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive the substrate plating surface;
• and
• d) an anode electrically connected to the electrolyte.

An apparatus for electrochemical deposition of a metal onto a substrate having a substrate plating surface, comprising:

• a) a substrate holder adapted to hold the substrate in a position wherein the substrate plating surface is exposed to an electrolyte in an electrolyte container;
• b) a cathode electrically contacting the substrate plating surface, wherein the cathode comprises a cathode contact member disposed at a peripheral portion of the substrate plating surface, the cathode contact member having a contact surface adapted to electrically contact the substrate surface, wherein the cathode contact member comprises a radial array of contact pins and a resistor connected in series with each contact pin;
• c) an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive the substrate plating surface;
• and
• d) an anode electrically connected to the electrolyte.

An apparatus for electrochemical deposition of a metal onto a substrate having a substrate plating surface, comprising:

• a) a substrate holder adapted to hold the substrate in a position wherein the substrate plating surface is exposed to an electrolyte in an electrolyte container;
• b) a cathode electrically contacting the substrate plating surface;
• c) an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive the substrate plating surface, wherein the electrolyte outlet is defined by a gap between a first surface on the substrate holder extending radially outward from the substrate plating surface and a surface of the electrolyte container;
• and
• d) an anode electrically connected to the electrolyte.

An apparatus for electrochemical deposition of a metal onto a substrate having a substrate plating surface, comprising:

• a) a substrate holder adapted to hold the substrate in a position wherein the substrate plating surface is exposed to an electrolyte in an electrolyte container;
• b) a cathode electrically contacting the substrate plating surface;
• c) an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive the substrate plating surface;
• d) an anode electrically connected to the electrolyte;
• and
• e) a control electrode disposed in electrical contact with the electrolyte, the control electrode adapted to provide an adjustable electrical power.

An apparatus for electrochemical deposition of a metal onto a substrate having a substrate plating surface, comprising:

• a) a substrate holder adapted to hold the substrate in a position wherein the substrate plating surface is exposed to an electrolyte in an electrolyte container;
• b) a cathode electrically contacting the substrate plating surface;
• c) an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive the substrate plating surface;
• d) an anode electrically connected to the electrolyte;
• and
• e) a vibrator attached to the substrate holder, the vibrator transferring a vibration to the substrate holder.

An apparatus for electrochemical deposition of a metal onto a substrate having a substrate plating surface, comprising:

• a) a substrate holder adapted to hold the substrate in a position wherein the substrate plating surface is exposed to an electrolyte in an electrolyte container;
• b) a cathode electrically contacting the substrate plating surface;
• c) an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive the substrate plating surface;
• d) an anode electrically connected to the electrolyte;
• and
• e) a sleeve insert disposed at a top portion of the electrolyte container, the sleeve insert defining the opening of the electrolyte container.

An apparatus for electrochemical deposition of a metal onto a substrate having a substrate plating surface, comprising:

• a) a substrate holder adapted to hold the substrate in a position wherein the substrate plating surface is exposed to an electrolyte in an electrolyte container;
• b) a cathode electrically contacting the substrate plating surface;
• c) an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive the substrate plating surface;
• d) an anode electrically connected to the electrolyte;
• and
• e) a flow adjuster wedge disposed at a top portion within the electrolyte container.

An apparatus for electrochemical deposition of a metal onto a substrate having a substrate plating surface, comprising:

• a) a substrate holder adapted to hold the substrate in a position wherein the substrate plating surface is exposed to an electrolyte in an electrolyte container,
• b) a cathode electrically contacting the substrate plating surface:
• c) an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive the substrate plating surface,
• d) an anode electrically connected to the electrolyte;
• and
• e) a gas knife to supply a gas flow across the wafer plating surface to remove residual electrolyte.

An apparatus for electrochemical deposition of a metal onto a substrate having a substrate plating surface, comprising:

• a) a substrate holder adapted to hold the substrate in a position wherein the substrate plating surface is exposed to an electrolyte in an electrolyte container;
• b) a cathode electrically contacting the substrate plating surface;
• c) an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive the substrate plating surface;
• d) an anode electrically connected to the electrolyte;
• and
• e) a wafer catcher disposed at a top portion within the electrolyte container.

An apparatus for electrochemical deposition of a metal onto a substrate having a substrate plating surface, comprising:

• a) a substrate holder adapted to hold the substrate in a position wherein the substrate plating surface is exposed to an electrolyte in an electrolyte container;
• b) a cathode electrically contacting the substrate plating surface;
• c) an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive the substrate plating surface;
• d) an anode electrically connected to the electrolyte;
• and
• e) a reference electrode adapted to monitor the cathode and the anode.

An apparatus for electrochemical deposition of a metal onto a substrate having a substrate plating surface, comprising:

• a) a substrate holder adapted to hold the substrate in a position wherein the substrate plating surface is exposed to an electrolyte in an electrolyte container;
• b) a cathode electrically contacting the substrate plating surface;
• c) an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive the substrate plating surface;
• d) an anode electrically connected to the electrolyte;
• and
• e) a rinsing solution supply selectively connected to the electrolyte inlet.

An apparatus for electrochemical deposition of a metal onto a substrate having a substrate plating surface, comprising:

• a) a substrate holder adapted to hold the substrate in a position wherein the substrate plating surface is exposed to an electrolyte in an electrolyte container;
• b) a cathode electrically contacting the substrate plating surface;
• c) an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive the substrate plating surface;
• d) an anode electrically connected to the electrolyte;
• and
• e) gas bubble diverting vanes disposed within the electrolyte container to divert gas bubbles toward an electrolyte container sidewall.

A method for electrochemical deposition of a metal onto a substrate, comprising:

• a) providing an electrochemical deposition cell comprising:
• 1) a substrate holder;
• 2) a cathode electrically contacting a substrate plating surface;
• 3) an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive a substrate plating surface;
• and
• 4) an anode electrically connected to an electrolyte;
• b) applying electrical power to the cathode and the anode;
• and
• c) flowing an electrolyte to contact the substrate plating surface, wherein the electrolyte flows between about 0.25 gallons per minute (gpm) to about 15 gpm.

A method for electrochemical deposition of a metal onto a substrate, comprising:

• a) providing an electrochemical deposition cell comprising:
• 1) a substrate holder;
• 2) a cathode electrically contacting a substrate plating surface;
• 3) an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive a substrate plating surface;
• and
• 4) an anode electrically connected to an electrolyte;
• b) applying electrical power to the cathode and the anode;
• and
• c) flowing an electrolyte to contact the substrate plating surface;
• wherein the step of applying an electrical power to the cathode and the anode comprises:
• 1) applying a cathodic current density between about 5 mA/cm2 and about 40 mA/cm2 for about 1 second to about 240 seconds.

A method for electrochemical deposition of a metal onto a substrate, comprising:

• a) providing an electrochemical deposition cell comprising:
• 1) a substrate holder;
• 2) a cathode electrically contacting a substrate plating surface;
• 3) an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive a substrate plating surface;
• and
• 4) an anode electrically connected to an electrolyte;
• b) applying electrical power to the cathode and the anode;
• and
• c) flowing an electrolyte to contact the substrate plating surface;
• wherein the step of applying an electrical power to the cathode and the anode comprises:
• 1) applying a cathodic current density between about 5 mA/cm2 and about 40 mA/cm2 for about 1 second to about 240 seconds;
• 2) applying a dissolution reverse current between about 5 mA/cm2 and about 80 mA/cm2 for about 0.1 seconds to about 100 seconds;
• 3) applying a cathodic current density between about 5 mA/cm2 and about 40 mA/cm2 for about 1 seconds to about 240 seconds;
• and
• 4) repeating step 2 and step 3.

A method for electrochemical deposition of a metal onto a substrate, comprising:

• a) providing an electrochemical deposition cell comprising:
• 1) a substrate holder;
• 2) a cathode electrically contacting a substrate plating surface;
• 3) an electrolyte container having an electrolyte inlet an electrolyte outlet and an opening adapted to receive a substrate plating surface;
• and
• 4) an anode electrically connected to an electrolyte;
• b) applying electrical power to the cathode and the anode;
• c) flowing an electrolyte to contact the substrate plating surface;
• d) providing a control electrode in electrical contact with an electrolyte of an electrochemical deposition cell;
• and
• e) adjusting the electrical power provided by the control electrode during deposition.

A method for electrochemical deposition of a metal onto a substrate, comprising:

• a) providing an electrochemical deposition cell comprising;
• 1) a substrate holder;
• 2) a cathode electrically contacting a substrate plating surface;
• 3) an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive a substrate plating surface;
• and
• 4) an anode electrically connected to an electrolyte;
• b) applying electrical power to the cathode and the anode;
• c) flowing an electrolyte to contact the substrate plating surface;
• and
• d) vibrating a component of the electrochemical deposition cell in one or more directions.

A method for electrochemical deposition of a metal onto a substrate, comprising:

• a) providing an electrochemical deposition cell comprising:
• 1) a substrate holder;
• 2) a cathode electrically contacting a substrate plating surface;
• 3) an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive a substrate plating surface;
• and
• 4) an anode electrically connected to an electrolyte;
• b) applying electrical power to the cathode and the anode;
• c) flowing an electrolyte to contact the substrate plating surface;
• and
• d) vibrating a component of the electrochemical deposition cell at a vibrational frequency between about 10 Hz and about 20,000 Hz and a vibrational amplitude between about 0.5 micron and about 100,000 micron.

A method for electrochemical deposition of a metal onto a substrate, comprising:

• a) providing an electrochemical deposition cell comprising:
• 1) a substrate holder;
• 2) a cathode electrically contacting a substrate plating surface;
• 3) an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive a substrate plating surface;
• and
• 4) an anode electrically connected to an electrolyte;
• b) applying electrical power to the cathode and the anode;
• c) flowing an electrolyte to contact the substrate plating surface;
• d) rotating the substrate holder about a central axis through the substrate.

An apparatus for electrochemical deposition of a metal onto a substrate, comprising:

• a) a substrate holder comprising:
• i) a vacuum chuck having a substrate support surface;
• and
• ii) an elastomer ring disposed around the substrate support surface, the elastomer ring contacting a peripheral portion of the substrate.
• b) a cathode electrically contacting a substrate plating surface;
• c) an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive a substrate plating surface, wherein the electrolyte outlet is defined by a gap between a first surface extending radially outward from the substrate plating surface and a surface of the electrolyte container;
• d) an anode electrically connected to an electrolyte, the anode comprising:
• i) a porous enclosure for flow of an electrolyte therethrough;
• ii) a metal disposed within the enclosure;
• and
• iii) an electrode disposed within the enclosure;
• e) a control electrode in electrical contact with an electrolyte, the control electrode adapted to provide an adjustable electrical power;
• and
• f) a vibrator attached to the substrate holder, the vibrator adapted to transfer a vibration in one or more directions to the substrate holder.