C25D 3/40
From cyanide baths
Official title: from cyanide baths {, e.g. with Cu+}
C25D3/40 (From cyanide baths) appears on 33 US grants and 43 published applications in this corpus.
Search patents in C25D- Granted patents
- 33
- Published applications
- 43
- Assignees
- 29
- Inventors
- 70
- Latest grant
- 13 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 3 |
| 2008 | 1 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 2 |
| 2011 | 0 | 0 |
| 2012 | 3 | 2 |
| 2013 | 1 | 3 |
| 2014 | 1 | 1 |
| 2015 | 0 | 1 |
| 2016 | 2 | 4 |
| 2017 | 2 | 4 |
| 2018 | 1 | 3 |
| 2019 | 5 | 2 |
| 2020 | 3 | 1 |
| 2021 | 3 | 2 |
| 2022 | 1 | 5 |
| 2023 | 5 | 4 |
| 2024 | 2 | 0 |
| 2025 | 1 | 4 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Methods for treating metal nanocrystals and for forming bulk nanostructured metal alloys13 Jan 2026US 12,522,928 B2Northwestern University
- Carbon-nanotubes copper composite conductors6 May 2025US 12,293,853 B2Technion Research & Development Foundation Limited
- Reactor for electrochemical deposition30 Jul 2024US 12,049,704 B2Fabric8Labs, Inc.
- Transformer helix winding production19 Mar 2024US 11,935,693 B2Enphase Energy, Inc.
- Oxide superconducting wire12 Sep 2023US 11,756,708 B2Fujikura Ltd.
- Ammonium salt compound, additive for electrolytic copper plating, electrolytic copper plating solution composition and electrolytic copper plating method4 Dec 2025US 2025/0369146 A1Samsung Electronics Co., Ltd.
- Carbon-nanotubes copper composite conductors28 Aug 2025US 2025/0273360 A1Technion Research & Development Foundation Limited
- Anode Array and Controller for Electrochemical Layer Deposition17 Apr 2025US 2025/0122638 A1Fabric8Labs, Inc.
- Electrochemical Layer Deposition by Anode Array Using Measurement Information6 Feb 2025US 2025/0043453 A1Fabric8Labs, Inc.
- Method for Filing at least One Hole formed in a Printed Circuit Board, a Printed Circuit Board filled in such a Manner, and a Vehicle Comprising such a Printed Circuit Board14 Dec 2023US 2023/0403797 A1
Most cited
By later US patents
- Three dimensional additive manufacturing of metal objects by stereo-electrochemical deposition34US 9,777,385 B2Fabric8Labs, Inc. · 2017
- Apparatus for electrochemical additive manufacturing25US 10,465,307 B2Fabric8Labs, Inc. · 2019
- Method of chrome plating magnesium and magnesium alloys24US 8,152,985 B2Arlington Plating Company · 2012
- Metal deposition methods for forming bimetallic structures, batteries incorporating bipolar current collectors made therefrom, and applications thereof16US 10,714,756 B2GM Global Technology Operations LLC · 2020
- Method of making electronic housings more reliable by preventing formation of metallic whiskers on the sheets used to fabricate them15US 5,730,851 AInternational Business Machines Corporation · 1998